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Title:
PROCESS PARAMETER SELECTION APPARATUS, PROCESS PARAMETER SELECTION METHOD, PROCESS PARAMETER SELECTION PROGRAM, AND PROGRAM STORAGE MEDIUM
Document Type and Number:
WIPO Patent Application WO/2010/119939
Kind Code:
A1
Abstract:
A process parameter selection apparatus which, in a production process including a plurality of production apparatuses having the same function, selects process parameters that can be used to create a prediction model for predicting quality with high serviceability and high precision. The apparatus sets the process parameters collected from the production process as explanatory variables and the inspection data collected from an inspection process as target variables. The apparatus runs a PLS analysis on each production apparatus separately, and selects, as the process parameters which are common to the production apparatuses and which are related to quality, the process parameters which have averages of VIP values, of individual process parameters, that are greater than or equal to reference values. The apparatus thus selects the process parameters that can be used to create a highly precise prediction model. Further, the apparatus reduces the number of managed process parameters as well as can set the process parameters to be common to all production apparatuses, reduce the man hours and time spent on process parameter management, and achieve high serviceability.

Inventors:
MASUI YUKI
Application Number:
PCT/JP2010/056819
Publication Date:
October 21, 2010
Filing Date:
April 16, 2010
Export Citation:
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Assignee:
SHARP KK (JP)
MASUI YUKI
International Classes:
H01L21/02; H01L21/66
Foreign References:
JP2005142467A2005-06-02
JP2008282248A2008-11-20
JP2009016758A2009-01-22
JP2007311581A2007-11-29
Attorney, Agent or Firm:
TANAKA, Mitsuo et al. (JP)
Mitsuo Tanaka (JP)
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