Title:
PROCESS FOR PRODUCING RESIN MOLDING HAVING MINUTE CAVITIES ON THE SURFACE
Document Type and Number:
WIPO Patent Application WO/1996/033065
Kind Code:
A1
Abstract:
A method of roughening the surface of a resin molding, in particular, a method suitable for roughening the surface of a layer insulation resin for multilayer printed wiring boards produced by the buildup method without fail. A resin molding having minute cavities on its surface is produced by molding a mixture of a resin composition and a powdery substance soluble in a chemical liquid to prepare a resin molding, treating the molding with a chemical liquid which dissolves the resin to remove the surface layer of the molding to thereby expose at least part of the powdery substance contained in the molding on the surface of the molding, and treating the surface with a chemical liquid which dissolves the powdery substance to dissolve off the exposed powdery substance.
Inventors:
KINASHI KEIICHI (JP)
CHIBA REIKO (JP)
HAGIWARA YOSHICHI (JP)
CHIBA REIKO (JP)
HAGIWARA YOSHICHI (JP)
Application Number:
PCT/JP1996/000817
Publication Date:
October 24, 1996
Filing Date:
March 28, 1996
Export Citation:
Assignee:
GRACE W R & CO (US)
KINASHI KEIICHI (JP)
CHIBA REIKO (JP)
HAGIWARA YOSHICHI (JP)
KINASHI KEIICHI (JP)
CHIBA REIKO (JP)
HAGIWARA YOSHICHI (JP)
International Classes:
C08J9/26; B29C59/00; B29C69/00; B29C70/64; C08J7/00; C25D5/56; H05K3/38; H05K3/46; B29K105/24; H05K3/00; (IPC1-7): B29C69/00; C25D5/56; H05K3/38
Foreign References:
| JPS5042377A | 1975-04-17 | |||
| JPS61253371A | 1986-11-11 | |||
| JPS61133381A | 1986-06-20 | |||
| JPS63245993A | 1988-10-13 |
Other References:
See also references of EP 0834391A4
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