USING A TWO-STEP ADDITION AND SUNFLOWER OR BRASSICA MATERIAL

The present invention relates to a process for preparing an article in the form of a lignocellulosic-based composite material. This process implements an adhesive composition that is used in two separate parts, a solid part comprising a sunflower or rapeseed meal in powder form and a liquid part made of several water soluble or dispersible compounds. These two separate parts are used in two separated steps in the process according to the invention.

International application WO2016/141126 discloses a process for preparing lignocellulosic-based composites, which are bonded with an adhesive composition comprising a protein source and a curing agent, namely a polyamidoamine-epichlorohydrin (PAE) resin. This International application proposes a dry process. The latter consists in combining the lignocellulosic material (wood furnish) with a liquid composition comprising PAE resin, urea, glycerol and water then adding a powdered protein source (soy flour) to the mixture before curing (Example 1b of WO2016/141126). An alternative dry process disclosed in Example 1c of WO2016/141126 consists in mixing the powdered protein source (soy flour) with the lignocellulosic material (wood furnish) before spraying the liquid composition as defined in Example 1b onto the mixture (soy flour + wood furnish).

As illustrated in Example 5 of WO2016/141126, the presence of urea in the liquid composition is an essential element for improving the strength of the lignocellulosic-based composite thus prepared (boards). Even though this dry addition process using soy flour delays the release of ammonia, it remains a problem during the process (strong odor and eye irritation). One solution is to heat-treat the soy flour to denature the urease (which is an additional and energy consuming step) or to use a soy protein isolate (which is an expensive solution). However, this solution may lead to boards having lower strength compared to the boards made with non-treated soy flour.

Surprisingly, the inventors have found that when using a ground sunflower or rapeseed meal instead of soy flour or instead of defibrated sunflower meal, no urea is required to achieve the desired properties. In addition, when urea is added to ground sunflower or rapeseed meal, no urease activity is observed. Thus, the use of ground sunflower or rapeseed meal not only is a good available alternative to soy flour (regarding adhesive and tack properties) but also its physical properties (with no urease activity) is an additional advantage over soy flour.

In addition, a 2-step addition process using ground sunflower or rapeseed meal enables to limit water addition from the binder compared to a 1-step addition in which all compounds are mixed together. Indeed, this 1-step addition shows several limitations, such as high viscosity or/and addition of high quantity of water that is an issue during the hot press (curing) step to produce lignocellulosic-based composite material.

International application WO2021/069689, published in the name of the Applicant, discloses a process for the manufacture of a lignocellulosic fiber-based composite material, such as a medium-density fiberboard (MDF), comprising the steps of i) obtaining a fibrous mix comprising a defibrated lignocellulosic material and defibrated plant seeds, ii) blending the fibrous mix with a resin to form a composite mixture, and iii) curing the composite mixture, thereby forming the lignocellulosic fiber-based composite material. The plant seeds which are defibrated (but not micronized) can be sunflower or rapeseed meal. Defibrated plant seed meal generally has a particle size (D50) of more than 400 pm. This document does not relate to the manufacture of other materials than lignocellulosic fiber-based composite materials, such as plywood, oriented strand board (OSB) or particleboard.

The process disclosed in WO2021/069689 cannot be applied to the manufacture of OSB or particleboard because during the industrial manufacture of OSB or particleboard, there are technical constraints to the mixing of wood chips/particles with wood fibers that cause, for example, the clogging of nozzles. This is also an issue for the recycling of used MDF which cannot be re-used for the manufacture of OSB and particleboards (used MDF panels are usually buried as waste).

Therefore, the invention relates to a process for preparing an article comprising: i) providing a two-part adhesive composition having

■ a liquid part comprising an amine-based azetidinium-functional cross-linker, a diluent and water, and

■ a solid part comprising ground Helianthus meal or ground Brassica meal or a mixture thereof, having a granulometry d50 of less than 300 pm, ii) adding either the liquid part or the solid part to a lignocellulosic material to provide a mixture, then iii) adding the remaining liquid or solid part to the mixture to provide a lignocellulosic material impregnated with the adhesive composition.

In a preferred embodiment, the invention relates to a process for preparing an article comprising: i') providing a two-part adhesive composition having a liquid part comprising an amine-based azetidinium-functional cross-linker, a diluent and water, and a solid part comprising ground Helianthus meal or ground Brassica meal or a mixture thereof, having a granulometry d50 of less than 300 pm, ii’) adding the solid part to a lignocellulosic material to provide a mixture, then iii’) adding the liquid part to the mixture to provide a lignocellulosic material impregnated with the adhesive composition.

In a preferred embodiment the solid part comprises ground Helianthus meal having a granulometry d50 of less than 300 pm.

By “liquid part’’, it is intended a phase which is liquid under normal temperature and pressure (i.e. 20°C and 1 atm).

Advantageously, the liquid part of the adhesive composition is sprayable. In particular, “sprayable” means that the viscosity at 20°C of the liquid part is advantageously less than 1000 mPa.s, preferably, less than 500 mPa. s, more preferably, less than 300 mPa.s and, even more preferably, less than 200 mPa.s, in particular less than 160 mPa.s.

The skilled person knows how to measure viscosity. Preferably, the viscosity can be measured as described in Example 1.

The liquid part may be a solution, a dispersion or a suspension.

By “solid part”, it is intended a phase which is solid under normal temperature and pressure (i.e. 20°C and 1 atm).

Advantageously, the two-part adhesive composition does not comprise soy meal.

By “amine-based azetidinium-functional cross-linker”, it is meant a cross-linker comprising amine and azetidinium groups.

By “cross-linker”, it is meant a compound or mixture of compounds comprising reactive groups.

Advantageously, in the process for preparing an article according to the invention, the amine-based azetidinium-functional cross-linker is an epichlorohydrin-based cross-linker.

By “epichlorohydrin-based cross-linker”, it is meant a cross-linker obtained from reacting epichlorohydrin.

Preferably, the epichlorohydrin-based cross-linker implemented in the process of the invention is a polyamidoamine-epichlorohydrin (PAE), a polyalkylenepolyamineepichlorohydrin (PAPAE), an amine polymer-epichlorohydrin (APE), or a combination thereof.

More preferably, the epichlorohydrin-based cross-linker is a polyamidoamine- epichlorohydrin (PAE).

Advantageously, the diluent includes one or more polyols.

Preferably, the diluent is selected from the group consisting of glycerol (or crude vegetable glycerine), propylene glycol, ethylene glycol, alkyl and aryl derivatives of glycerol, alkyl and aryl derivatives of propylene glycol, alkyl and aryl derivatives of ethylene glycol, carbohydrate sugars and other polyols such as glucose, fructose, sorbitol, isosorbide, maltitol, mannitol, and erythritol, and/or from the group consisting of oligomers and polymers of any of the earlier listed monomers such as polyglycerols, polyethylene glycol (PEG) polypropylene glycols (PPG), glucose syrups, maltodextrins, dextrins, modified starches, and mixtures thereof.

It should be noted that some of the above-listed diluents are solid under normal temperature and pressure (i.e. 20°C and 1 atm). Nevertheless they can act as diluents as soon as dissolved in the liquid part.

More preferably, in the process for preparing an article according to the invention, the diluent is glycerol or crude vegetable glycerin.

One benefit of using glycerol and various low-viscosity polyols is that they allow less water to be used in the adhesive composition. The benefit comes in addition to separating the liquid and solid parts of an adhesive composition. Reducing the amount of water, while retaining a low-viscosity liquid part, desirably reduces the risk that the composite formed therefrom is damaged by steam generated during formation of the composite at high temperature.

Advantageously, the pH of the liquid part of the adhesive composition is comprised between 2 and 12, preferably between 4 and 11 , more preferably, between 5 and 9. Thanks to the components contained in the liquid part of the adhesive composition, the latter can “naturally” present a pH in the above-defined ranges i.e. without requesting any adjustment. Alternatively, the pH of the liquid part of the adhesive composition may be adjusted, in particular, depending on the optimum pH of the amine-based azetidinium-functional crosslinker. For example, the pH of the liquid part of an adhesive composition comprising PAE is preferably about 8 to 11, for example about 8.

By “ground Helianthus meal” or “ground Brassica meal”, it is intended a powder (or flour) obtained from a seed belonging to the genus Helianthus or Brassica respectively, which has been submitted to a fat (oil) extraction step, i.e., which has been at least partially defatted. The Helianthus meal can be a Helianthus seed press-cake, a solvent extracted Helianthus seed meal or a Helianthus seed press-cake which has further been submitted to a solvent extraction. The Brassica meal can be a Brassica seed press-cake, a solvent extracted Brassica seed meal or a Brassica seed press-cake which has further been submitted to a solvent extraction. The solvent used to prepare the solvent extracted Helianthus meal or Brassica meal may be organic and/or aqueous, such as hexane, alcohol or aqueous alcohol, preferably hexane. More preferably, the ground Helianthus meal or ground Brassica meal is a ground hexane-extracted Helianthus seed meal or Brassica meal respectively.

Preferably, “ground Helianthus meal” and “ground Brassica meal” refers to a micronized Helianthus or Brassica meal. They do not refer to a heat-treated meal, a meal treated with an acid and/or a meal obtained from defibrated Helianthus or Brassica plant or a part thereof. By “heat-treated meal”, it is meant that the meal has been submitted to a heat treatment at a temperature of at least 130°C. By “defibrated”, it is intended passed through a defibrating apparatus such as a refiner or a defibrator (such as by the Asplund or Mason method).

The Helianthus seed can be a whole Helianthus seed, a partially dehulled Helianthus seed or a fully dehulled Helianthus seed.

Advantageously, Helianthus refers to one or more plants belonging to the species Helianthus agrestis, Helianthus ambiguous, Helianthus angustifolius, Helianthus annuus, Helianthus anomalus, Helianthus argophyllus, Helianthus arizonensis, Helianthus atrorubens, Helianthus bolanderi, Helianthus californicus, Helianthus carnosus, Helianthus ciliaris, Helianthus cinereus, Helianthus coloradensis, Helianthus cusickii, Helianthus debilis, Helianthus decapetalus, Helianthus deserticola, Helianthus dissectifolius, Helianthus divaricatus, Helianthus eggertii, Helianthus exilis, Helianthus floridanus, Helianthus giganteus, Helianthus glaucophyllus, Helianthus gracilentus, Helianthus grosseserratus, Helianthus heterophyllus, Helianthus hirsutus, Helianthus laciniatus, Helianthus laevigatus, Helianthus lenticularis, Helianthus longifolius, Helianthus maximiliani, Helianthus membranifolius, Helianthus microcephalus, Helianthus mollis, Helianthus multiflorus, Helianthus navarri, Helianthus neglectus, Helianthus niveus, Helianthus nuttallii, Helianthus occidentalis, Helianthus paradoxus, Helianthus pauciflorus, Helianthus petiolaris, Helianthus porter, Helianthus praecox, Helianthus pumilus, Helianthus radula, Helianthus resinosus, Helianthus salicifolius, Helianthus sarmentosus, Helianthus scaberrimus, Helianthus schweinitzii, Helianthus silphioides, Helianthus simulans, Helianthus smithii, Helianthus speciosus, Helianthus strumosus, Helianthus subcanescens, Helianthus subtuberosus and/or Helianthus verticillatus, preferably, the ground Helianthus meal is ground Helianthus annuus meal.

The Brassica seed can be a whole Brassica seed, a partially dehulled Brassica seed or a fully dehulled Brassica seed.

Advantageously, Brassica refers to one or more plants belonging to the species Brassica napus e.g., rapeseed, canola), Brassica juncea, Brassica nigra, Brassica rapa and/or Brassica carinata. Preferably, the ground Brassica meal is ground Brassica napus meal, in particular ground rapeseed or canola meal.

In a particular embodiment, the ground Helianthus or Brassica meal has a granulometry d50 between 1 pm and 300 pm, preferably, between 10 pm and 275 pm and, more preferably, between 20 pm and 250 pm, most preferably between 20 pm and 140 pm.

Advantageously, the ground Helianthus or Brassica meal further has a granulometry d90 of less than 800 pm, preferably less than 400 pm.

It will be noted that in the context of the present application, and unless otherwise stipulated, the ranges of values indicated are understood to be inclusive.

By “about” a value, it is meant said value plus or minus 10%.

The granulometry d50 and d90 are well known by the skilled person as the maximum size of 50% and 90% respectively of the smallest particles in weight, and can be measured with a granulometer, for example according to the method described in Example 1 “Materials”.

Advantageously, the ground Helianthus or Brassica meal comprises between 10% and 65% by weight of crude proteins, preferably, between 20% and 55%, more preferably, between 25% and 50%, based on dry matter.

The crude protein content of the ground Helianthus or Brassica meal can be measured following the Kjeldahl procedure (NF EN ISO 5983-2: 2009) with a nitrogen-to- protein conversion factor of 6.25.

Advantageously, the ground Helianthus or Brassica meal comprises between 0% and 15% by weight of oil, preferably, between 0% and 10%, more preferably, between 0% and 5% even more preferably, between 0.1% and 2.5%, based on dry matter.

By “lignocellulosic material”, it is meant a lignocellulosic material different from the ground Helianthus or Brassica meal, in particular straw, paper, cardboard, wood strands, and/or wood particles, preferably, wood strands and/or wood particles, more preferably wood particles. The wood particles can be chips, flakes (or strands), sawdust, powder or any other waste based on wood originating from a sawmill. The lignocellulosic material is not wood fibers, obtainable by processing wood chips in a defibrating apparatus such as a refiner or defibrator.

Preferably, the wood is pine wood, spruce wood, birch wood and/or beech wood, more preferably, the wood is spruce wood.

Advantageously, the article is a wood board, preferably, the article is plywood, oriented strand board (OSB) or particleboard, more preferably, the article is OSB or particleboard even more preferably particleboard.

Advantageously, the article is not obtained from defibrated lignocellulosic material and/or from defibrated Helianthus or Brassica meal. In addition, the article is also not obtained from wood fibers.

Advantageously, in the process according to the invention, the adhesive composition further comprises at least one additive.

Exemplary additives usable in the invention include clays, in particular, an intercalated clay, partially exfoliated clay, exfoliated clay, for example montmorillonite, cellulose nanoparticles, catalysts, tacking agents, extenders, fillers, viscosifying agents, surfactants, adhesion promoters, antioxidants, antifoaming agents, antimicrobial agents, antibacterial agents, fungicides, pigments, inorganic particules (e.g., titanium dioxide, yellow iron oxide, red iron oxide, black iron oxide, zinc oxide, aluminum oxide, aluminum trihydrate, calcium carbonate, magnesium oxide), gelling agents, aereosolozing agents, cross-linking agents, agents that improve moisture resistance, pH modulators, composite-release promoters, formaldehyde scavenging agents, fire retardants, wetting agents, and wood preservatives.

The at least one additive may be a water-dispersible additive or a water-soluble additive. Water-soluble additives include hydroxyl-functional or amine-functional compounds.

The at least one additive may also be a non-volatile (e.g., having a boiling point of greater than about 180°C, at atmospheric pressure), inert viscosity-reducing diluent.

The at least one additive may be at least one agent that improves moisture-resistance, a composite-release promoter (such as a composite-release promoter selected from the group consisting of a C -25 alkanoic acid, a salt of a C -25 alkanoic acid, a C10-25 alkenoic acid, a salt of an C10-25 alkenoic acid, and a silicone).

In particular, the at least one additive may be a fire retardant, wood preservative, antimicrobial agent, antibacterial agent or fungicide, any of which may be in the form of nanoparticles.

Advantageously, if the adhesive composition comprises one or more additives, each additive present in the adhesive composition is independently present in an amount ranging from 0.001% (w/w) to about 20% (w/w), from 0.01% (w/w) to about 20% (w/w) from 0.1% (w/w) to about 15% (w/w), from 0.1 % (w/w) to about 10% (w/w), from 0.5% (w/w) to about 20% (w/w), from 0.5% (w/w) to about 15% (w/w), from 0.5% (w/w) to about 10% (w/w), from 0.5% (w/w) to about 5% (w/w), from 1% (w/w) to about 20% (w/w), from 1% (w/w) to about 10% (w/w), from 1% (w/w) to about 5% (w/w), from 1% (w/w) to about 3% (w/w) or from 5% (w/w) to about 10% (w/w). In certain embodiments, such as where the additive is a fire retardant, the additive may be present in the adhesive composition in an amount ranging from about 1 % (w/w) to about 40% (w/w), from about 10% (w/w) to about 40% (w/w), from about 20% (w/w) to about 40% (w/w), or from about 25% (w/w) to about 35% (w/w).

It should be noted that some of the below-listed additives are solid under normal temperature and pressure (i.e. 20°C and 1 atm). Therefore they can be added to the solid part of the adhesive composition or added to the liquid part of the adhesive composition as soon as dissolved in said adhesive composition.

In certain embodiments, the additives (in solid and/or liquid form) can be added to the lignocellulosic material at any step of the process of the invention.

Exemplary classes of additives usable in the present invention are described in more detail below.

Intercalated Clay

Intercalated clays can be obtained from commercial sources or prepared by exposing a clay to an intercalating agent. Exemplary types of clay that may be converted to intercalated form include, for example, smectite clays, illite clays, chlorite clays, layered polysilicates, synthetic clays and phyllosilicates. Exemplary specific clays that may be converted to intercalated form include, for example, montmorillonite (e.g., sodium montmorillonite, magnesium montmorillonite and calcium montmorillonite), beidellite, pyrophyllite, talc, vermiculite, sobockite, stevensite, svinfordite, sauconite, saponite, volkonskoite, hectorite, nontronite, kaolinite, dickite, nacrite, halloysite, hisingerite, rectorite, tarosovite, ledikite, amesite, baileychlore, chamosite, clinochlore, kaemmererite, cookeite, corundophilite, daphnite, delessite, gonyerite, nimite, odinite, orthochamosite, penninite, pannantite, rhipidolite, prochlore, sudoite, thuringite, kanemite, makatite, ilerite, octosilicate, magadiite and kenyaite. In certain embodiments, the clay converted to intercalated form is montmorillonite.

Exemplary intercalating agents include, for example, quaternary amine compounds (such as a tetra-alkylammoniun salt), polymers (e.g., a polycaprolactone, maleated polyethylene, or maleated polypropylene) an acrylic monomer, phosphonium compounds, arsonium compounds, stibonium compounds, oxonium compounds, sulfonium compounds, polypropene, fatty acid esters of pentaerythritol, a steroyl citric acid ester and alcohols (such as aliphatic alcohols, aromatic alcohols (e.g., phenols), aryl substituted aliphatic alcohols, alkyl substituted aromatic alcohols, and polyhydric alcohols).

Intercalated clays can be characterized by, for example, the following physical properties: interlayer spacing, d-spacings, clay particle size, particle size distribution, peak degradation temperature, and thickness of layers. Exemplary physical property features for intercalated clays contemplated to be amenable for use in the present invention include, for example, one or more of the following: (i) an intercalated clay having an interlayer spacing of about 0.5 A to about 100 A (or about 1 A to about 20 A), (ii) a mean particle size of about 1 pm to about 150 pm (or about 20 pm to about 100 pm), (Hi) a particle size distribution where about 90 percent to about 50 percent of the intercalated clay particles have a particle size of from about 20 pm to about 100 pm (or about 85 percent to about 65 percent of the intercalated clay particles have a particle size of about 20 pm to about 100 pm), (iv) a peak degradation temperature of about 200°C to about 600°C (or from about 300°C to about 500°C), and/or (v) layers in the intercalated clay have a thickness of about 0.5 A to about 100 A (or about 5 A to about 50 A).

In certain other embodiments, the intercalated clay is intercalated montmorillonite having a particle size of less than about 500 nm, or less than about 100 nm. In certain other embodiments, the intercalated clay is intercalated montmorillonite having a particle size of about 60 nm to about 400 nm.

The clay (e.g., an intercalated clay) may be surface treated with an organic compound, such as a hydrophobic organic compound or hydrophilic organic compound, in order to promote dispersion of the clay in a formulation, such as an adhesive composition described herein. Surface treatment methods and compositions are described in the literature and are contemplated to be amenable for use in the present invention.

The intercalated clay may be added to the solid part or to the liquid part of the adhesive composition. Advantageously, the intercalated clay is added to the solid part of the adhesive composition.

Different intercalated clays may impart different performance properties to the adhesive composition. Accordingly, in certain embodiments, the intercalated clay is an intercalated smectite. In certain other embodiments, intercalated clay is a smectite that has been intercalated with a quaternary ammonium compound. In certain other embodiments, the intercalated clay is an intercalated montmorillonite. In yet other embodiments, the intercalated clay is montmorillonite intercalated with a dimethyl-di(Ci4-is) alkyl ammonium salt.

Exfoliated Clay & Partially Exfoliated Clay

Exfoliated clay or a partially exfoliated clay can be prepared by exposing an intercalated clay to exfoliation conditions using procedures described in the literature. One procedure for preparing a partially exfoliated clay is to subject an intercalated clay to high shear mixing and/or sonication (e.g., using ultrasound) until the intercalated clay has partially exfoliated. The procedure may be performed by placing the intercalated clay (e.g., quaternary amine intercalated montmorillonite) in a hydrophobic liquid medium (such as mineral oil, soy oil, castor oil, silicone oil, a terpene (e.g., limonene), plant oil alkyl esters (e.g., soy methyl ester and canola methyl ester), mixtures thereof (e.g., a mixture of a silicone oil and limonene), etc.) to form a mixture, and then subjecting the mixture to high shear mixing and/or ultrasound until the intercalated clay has partially exfoliated. Partial exfoliation occurs when clay platelets separate from the intercalated clay particles. The intercalated clay may be added to the adhesive composition, and the adhesive composition is subjected to exfoliation conditions to generate the partially exfoliated clay in situ.

An exfoliated clay can be prepared by exposing an intercalated clay to high shear mixing and/or sonication (e.g., using ultrasound) until substantially all (e.g., greater than 90% w/w, 95% w/w, or 98% w/w) the intercalated clay has exfoliated. The exfoliation procedure can be performed by placing the intercalated clay (e.g., quaternary amine intercalated montmorillonite) in a hydrophobic liquid medium (such as mineral oil, soy oil, castor oil, silicone oil, a terpene (e.g., limonene), plantoil alkyl esters (e.g., soy methyl ester and canola methyl ester), mixtures thereof (e.g., a mixture of a silicone oil and limonene), etc.) to form a mixture, and then subjecting the mixture to high shear mixing and/or sonication (e.g., using ultrasound) until substantially all (e.g., greater than 90% w/w, 95% w/w, or 98% w/w) the intercalated clay has exfoliated. Alternatively, the intercalated clay may be added to the adhesive composition, and the adhesive composition is subjected to exfoliation conditions to generate the exfoliated clay in situ. Alternatively, a clay (such as sodium montmorillonite) may be added to an adhesive composition, together with a quaternary ammonium compound, and optionally together with a satisfactory oil carrier (e.g., one that has the ability to solvate the quaternary compound), and the resulting adhesive composition is subjected to conditions to intercalate the clay and to generated the exfoliated clay or partially exfoliated clay in situ. In addition, if so desired, the quaternary ammonium compound can be pre-dissolved in the oil carrier before it is added to the adhesive composition together with a clay.

In all the above alternatives, the exfoliated clay or the clay together with a quaternary ammonium compound, and optionally together with a satisfactory oil carrier may be added to the solid part or to the liquid part of the adhesive composition. Advantageously, the exfoliated clay or the clay together with a quaternary ammonium compound, and optionally together with a satisfactory oil carrier is/are added to the solid part of the adhesive composition.

Exemplary partially exfoliated clays contemplated to be amenable for use in present invention include partially exfoliated forms of smectite clay, illite clay, chlorite clay, layered polysilicates, synthetic clay and phyllosilicates. Exemplary specific partially exfoliated clays contemplated to be amenable for use in present invention include partially exfoliated forms of, for example, montmorillonite (e.g., sodium montmorillonite, magnesium montmorillonite, andcalcium montmorillonite), beidellite, pyrophyllite, talc, vermiculite, sobockite, stevensite, svinfordite, sauconite, saponite, volkonskoite, hectorite, nontronite, kaolinite, dickite, nacrite, halloysite, hisingerite, rectorite, tarosovite, ledikite, amesite, baileychlore, chamosite, clinochlore, kaemmererite, cookeite, corundophilite, daphnite, delessite, gonyerite, nimite, odinite, orthochamosite, penninite, pannantite, rhipidolite, prochlore, sudoite, thuringite, kanemite, makatite, ilerite, octosilicate, magadiite and kenyaite. In certain embodiments, the partially exfoliated clay is partially exfoliated clay montmorillonite.

A partially exfoliated clay can be characterized by, for example, the amount of clay particles that are in the form of platelets. In certain embodiments, about 0.1% w/w to about 40% w/w, about 0.1% w/w to about 20% w/w, about 0.1% w/w to about 10% w/w, about 0.1 % w/w to about 5% w/w, about 5% w/w to about 20% w/w of the clay particles are in the form of platelets. In certain embodiments, about 0.1% w/w to about 40% w/w of the clay particles are in the form of platelets having a size of about 1 A to about 50 A, about 30 A to about 50 A or about 5 A to about 20 A.

Exemplary exfoliated clays contemplated to be amenable for use in present invention include exfoliated forms of smectite clay, illite clay, chlorite clay, layered polysilicates, synthetic clay and phyllosilicates. Exemplary specific exfoliated clays contemplated to be amenable for use in present invention include exfoliated forms of, for example, montmorillonite (e.g., sodium montmorillonite, magnesium montmorillonite, and calcium montmorillonite), beidellite, pyrophyllite, talc, vermiculite, sobockite, stevensite, svinfordite, sauconite, saponite, volkonskoite, hectorite, nontronite, kaolinite, dickite, nacrite, halloysite, hisingerite, rectorite, tarosovite, ledikite, amesite, baileychlore, chamosite, clinochlore, kaemmererite, cookeite, corundophilite, daphnite, delessite, gonyerite, nimite, odinite, orthochamosite, penninite, pannantite, rhipidolite, prochlore, sudoite, thuringite, kanemite, makatite, ilerite, octosilicate, magadiite and kenyaite. In certain embodiments, the exfoliated clay is an exfoliated smectite. In certain embodiments, the exfoliated clay is exfoliated montmorillonite.

An exfoliated clay can be characterized by, for example, the size of platelets and the aspect ratio of platelets. In certain embodiments, the size of the platelets is about 1 A to about 50 A, about 30 A to about 50 A or about 5 A to about 20 A. In certain embodiments, the aspect ratio of the platelets is about 100 to about 10000, about 100 to about 5000 or about 200 to about 2000. In certain other embodiments, the exfoliated clay has a mean particle size of less than about 500 nm, less than 100 nm or less than 25 nm. In certain other embodiments, the exfoliated clay has a mean particle size of from about 60 nm to about 400 nm, about 50 nm to about 300 nm, about 40 nm to about 200 nm or about 20 nm to about 150 nm.

In certain other embodiments, a partially exfoliated clay is formed by exposing a clay to an effective amount of a protein component (e.g., ground Helianthus or Brassica meal) to form a mixture and subjecting the mixture to exfoliation conditions, such as high shear mixing and/or sonication. In certain other embodiments, an exfoliated clay is formed by exposing a clay to an effective amount of protein component (e.g., ground Helianthus or Brassica meal) to form a mixture and subjecting the mixture to exfoliation conditions, such as high shear mixing and/or sonication.

Cellulose Nanoparticle

Cellulose nanoparticles can be added to the adhesive composition to achieve certain performance properties, such as to provide an adhesive composition with increased toughness and/or bond strength. Cellulose nanoparticles can be obtained from commercial sources or isolated from plant-based fibers by acid-hydrolysis. Cellulose nanoparticles can be characterized by, for example, the size of the nanoparticle, the cross-sectional shape of the nanoparticle, and the cross-sectional length and aspect ratio of the nanoparticle. Accordingly, in certain embodiments, the cellulose nanoparticle has a size of from about 1 nm to about 2000 nm, about 10 nm to about 1000 nm, about 10 nm to about 500 nm or about 10 nm to about 200 nm. In certain embodiments, the cross-sectional shape of the nanoparticle may be triangular, square, pentagonal, hexagonal, octagonal, circular, or oval. In certain other embodiments, the average cross-sectional length of the cellulose nanoparticle is about 0.1 nm to about 100 nm, or about 1 nm to about 10 nm.

One type of cellulose nanoparticles that may provide certain advantages are cellulose nanofibers. Exemplary cellulose nanofibers are described in, for example, U.S. Patent Application Publication Nos. 2010/0233481 , 2010/0240806 and 2010/0282422.

Catalyst

A catalyst may be added to the adhesive composition to facilitate polymerization. Exemplary catalysts include, for example, a primary amine, a secondary amine, a tertiary amine, an organometallic compound, or a combination thereof. Exemplary primary amines include, for example, methylamine, ethylamine, propylamine, cyclohexylamine, and benzylamine. Exemplary secondary amines include, for example, dimethylamine, diethylamine, and diisopropylamine. Exemplary tertiary amines include, for example, diazabicyclooctane (Dabco), triethylamine, dimethyl benzylamine, bis-dimethylaminoethyl ether, tetramethyl guanidine, bis-dimethylaminomethyl phenol, 2,2'-dimorpholinodiethyl ether, 2-(2-dimethylaminoethoxy)-ethanol, 2-dimethylaminoethyl-3-dimethylaminopropyl ether, bis-(2-diaminoethyl)-ether, N,N-dimethyl piperazine, N-(2-hydroxyethoxyethyl)-2- azanorbornane, Tacat DP-914 (Texaco Chemical), Jeffcat® , N,N,N,N-tetramethyl butane- 1 ,3 -diamine, N,N,N,N-tetram ethyl propane- 1 ,3 -diamine, N,N,N,N-tetramethyl hexane-1 ,6- diamine, 2,2'-dimorpholinodiethyl ether (DMDEE), or a mixture thereof. Exemplary organometallic compounds include, for example, di-n-octyl tin mercaptide, dibutyl tin maleate, diacetate, dilaurate, dichloride, bis-dodecyl mercaptide, tin(ll)acetate, ethyl hexoate and diethyl hexoate, Fe ³⁺ 2,4-pentanedionate (FeAcAc) or lead phenyl ethyl dithiocarbamate.

In certain other embodiments, the catalyst is a transition metal acetyl acetonate, e.g., an acetylacetonate compound comprising iron, copper, or nickel. In certain embodiments, the transition metal acetylacetonate comprises a tertiary amine, e.g., 2,2'-dimorpholino diethyl ether.

The amount of catalyst used in the adhesive composition can be varied in order to optimize the features of the adhesive composition. In certain embodiments, the catalyst is present in less than 1 % (wt/wt), 0.5% (wt/wt) or 0.1% (wt/wt) of the adhesive composition. In certain other embodiments, the catalyst is present in a range from 0.001% (wt/wt) to 0.75% (wt/wt), 0.001% (wt/wt) to 0.01% (wt/wt), 0.01% (wt/wt) to 0.05% (wt/wt) or 0.05% (wt/wt) to 0.5% (wt/wt) of the adhesive composition.

Tacking Agent

Exemplary tacking agents include, for example, corn syrup, soy oil, a poly(C2-Ce) alkylene, mineral oil, an ethylene/propylene/styrene copolymer, a butylene/ethylene/styrene copolymer, or a mixture of one or more of the foregoing. Other exemplary tacking agents are copolymers that have a low glass transition temperature (Tg) (e.g., a latex-based, acrylic copolymer with a Tg of less than about 0°C, and preferably less than about -20 °C). In certain embodiments, the additive is polybutene. In certain embodiments, the polybutene has a weight average molecular weight of from about 200 g/mol to about 20000 g/mol, from about 200 g/mol to about 10000 g/mol, from about 200 g/mol to about 5000 g/mol, from about 200 g/mol to about 2000 g/mol, from about 200 g/mol to about 1000 g/mol, from about 500 g/mol to about 2000 g/mol, or from about 500 g/mol to about 1000 g/mol. Other tacking agents include a solid selected from the group consisting of a terpene resin, a rosin ester derivative, and a hydrocarbon-based derivative. When the tacking agent is a solid, the solid tacking agent can be pre-melted and dispersed in water by means of the ground Helianthus or Brassica meal, or the solid tacking agent can be ground and dispersed as fine particulates directly into the adhesive composition.

Alternatively, the tacking agent may be added to the solid part or to the liquid part of the adhesive composition. Advantageously, the tacking agent is added to the solid part of the adhesive composition.

Extender

Exemplary extenders include, for example, inert extenders or active extenders. In certain embodiments, the inert extender is vegetable particulate matter, dibasic esters, propylene carbonate, non-reactive modified aromatic petroleum hydrocarbons, soy oil, and castor oil. Another inert extender or is any non-active hydrogen containing solid that is soluble, e.g., soluble in oil or soluble in water. The active extender can be a pyrrolidone monomer or polymers, an oxizolidone monomer or polymers, an epoxidized oil, or an unsaturated oil, such as linseed oil. Another active extender is a vinyl monomer or mixture of vinyl monomers.

Surfactant & Adhesion Promoter

Exemplary surfactants include, for example, monomeric types, polymeric types, or mixtures thereof. Exemplary adhesion promoters include, for example, organosilanes and titanates.

Antimicrobial Agent

Antimicrobial agents known in the art that do not substantially react with the amine- based azetidinium-functional cross-linker are contemplated for use in the adhesive composition and article described herein. One exemplary antimicrobial agent is benzoic acid, propionic acid, sodium benzoate, orbic acid and potassium sorbate.

Crosslinking Agent

In other embodiments, the additive can be a crosslinking agent, for example, a crosslinking agent that can be used to bond lignocellulosic material to glass. Exemplary crosslinking agents include an organosilane, such as dimethyldichlorosilane (DMDCS), alkyltrichlorosilane, methyltrichlorosilane (MTCS), N-(2-aminoethyl)-3-aminopropyl trimethoxysilane (AAPS), or a combination thereof. In other embodiments the ground Helianthus or Brassica meal is combined with an organosilane to form an adhesive for bonding one or more substrates together in any combination, said substrates including glass, paper, wood, ceramic, steel, aluminum, copper, brass, etc. The term "organosilane" refers to any group of molecules including monomers, hydrolyzed monomers, hydrolyzed dimers, oligomers, and condensation products of a trialkoxysilane having a general formula: (RO)sSi-R' where R is preferably a propyl, ethyl, methyl, isopropyl, butyl, isobutyl, sec-butyl, t-butyl or acetyl group, and R' is an organofunctional group where the functionality may include an aminopropyl group, an aminoethylaminopropyl group, an alkyl group, a vinyl group, a phenyl group, a mercapto group, a styrylamino group, a methacryloxypropyl group, a glycidoxy group, an isocyante group, or others.

Similarly, a bis-trialkoxysilane having the general formula (RO)sSi-R'-Si(OR)3 can also be employed as an "organosilane" either alone or in combination with a trialkoxysilane, where R is preferably a propyl, ethyl, methyl, isopropyl, butyl, isobutyl, sec-butyl, t-butyl or acetyl group, and R is a bridging organofunctional residue which may contain functionality selected from the group consisting of amino groups, alkyl groups, vinyl groups, phenyl groups, mercapto groups, and others. Similarly, a tetraalkoxysilane having the general formula (RO)4Si can also be employed as an "organosilane" either alone or in combination with a trialkoxysilane or a bis-trialkoxysilane, where R is preferably a propyl, ethyl, methyl, isopropyl, butyl, isobutyl, sec -butyl, t-butyl or acetyl group.

Agent that Improves Moisture-Resistance

Agents that improve moisture-resistance refer to those materials that, when added to adhesive compositions described herein, improve the ability of a wood composite formed from the adhesive to be resistant to water, i.e. , not absorb water. Exemplary types of agents that improve moisture resistance include fluorinated polyol compounds, silicones, siloxanes (including functionalized siloxane polymers, such as hydroxy-terminated siloxane polymers or hydroxyl alkyl siloxane polymers), polyolefin polymers, wax (e g., fatty acids (such as an alkyl carboxylic acid), salts of a fatty acid (e.g., an alkali metal salt of an alkyl carboxylic acid), esters of a fatty acid (e.g., an alkyl ester of a carboxylic acid, an aryl ester of a carboxylic acid, an alkyl ester of an alkanoic acid, or an aryl ester of an alkanoic acid), fatty alcohols, mixtures of hydrophobic hydrocarbons, water-based emulsions containing hydrophobic hydrocarbons dispersed therein, a hydrocarbon wax, a fluoroalkylphosphate wax, a fluorinated hydrocarbon wax, and a fluoroalkyl functionalized wax), and hydrophobic oils. Another agent that improves moisture-resistance is a fluorinated silicone. When an agent that improves moisture-resistance is present in an adhesive composition, it is desirably present in an amount effective to increase moisture resistance (e.g., an increase in moisture resistance of at least about 2%, 5%, 10%, or 20% compared to the moisture resistance of a composite formed from an adhesive composition lacking the agent that improves moisture-resistance).

Agents that improve moisture-resistance may be present in the final composite at a weight percent in the range of about 0.01 % (w/w) to about 5% (w/w), about 0.01 % (w/w) to about 2% (w/w), about 0.01 % (w/w) to about 1 % (w/w), about 0.01 % (w/w) to about 0.5% , about 0.1 % (w/w) to about 2% (w/w), (w/w), about 0.1 % (w/w) to about 1 % (w/w) or about 0.5% (w/w) to about 1 % (w/w).

One exemplary fluorinated polyol compound is FluoroLink D-10 fluorinated polyol that is commercially available from Solvay Solexis, Inc. Exemplary silicones include Dow Corning FS-1265 Fluid, 300 cST (Trifluoropropyl Methicone) from Dow Corning), and T-Sil- 601 1 SE Emulsion (60% Solids), from Siovation, Inc. which is a emulsion containing 60% w/w silicones. The silicone may be organically modified, such as C2o-24Alkyl Methicone, C24- 28 Alkyl Methicone, C30-45 Alkyl Methicone, Stearyl Dimethicone, Biphenyl Dimethicone, Stearoxy Dimethicone, C20-24 Alkyl Dimethicone, or C24-28 Alkyl Dimethicone.

Exemplary types of functionalized siloxane polymers include (1) a hydroxyterminated siloxane polymer such as hydroxy- terminated polydimethylsiloxane (e.g., T-Sil- 80, a linear hydroxy terminated polydimethylsiloxane from Siovation, Inc.), (2) a hydroxyl alkyl polydimethylsiloxane (e.g., Tego Protect-5000 functionalized silicone fluid commercially available from Evonik Tego Chemie GmbH), and (3) a fluorinated siloxane.

Exemplary waxes include Hexion EW-58H; BE Square 165 Amber Petroleum Macrocrystalline Wax commercially available from Baker Hughes, Inc., which is a mixture comprising paraffinic, isoparaffinic, and naphthenic hydrocarbons; Masurf FS 115 Emulsion (a fluoroalkylphosphate wax dispersion in water — 28% Solids) commercially available from Mason Chemical Company; carnauba wax; candelilla wax; japan wax; beeswax; rice bran wax; montan wax; paraffin; ceresin; lanolin; ozokerita; slack wax (which is semi-refined wax having an oil content up to about 30 mass percent, and often produced by chilling and solvent filter-pressing wax distillate); polyethylene wax; a fatty acid or salt thereof (e.g., C10- 25 alkanoic acid, a salt of a C10-25 alkanoic acid, a C10-25 alkenoic acid, a salt of an C10-25 alkenoic acid; such as stearic acid, zinc stearate, or lauric acid), a fatty ester (e.g., an ester of an C10-25 alkanoic acid or C10-25 alkenoic acid); or fatty alcohol (e.g., C10-25 hydroxy alkane or C10-25 hydroxy alkene).

Exemplary hydrophobic polymers include a polyolefin (e.g., polyethylene, polypropylene, polybutylene, polystyrene, copolymers of the foregoing, polyethylene/polyvinyl acetate copolymer, and polyethylene/polyacrylic acid copolymer).

Exemplary hydrophobic oils include soy lecithin, castor oil, linseed oil, tung oil, and a fluorinated hydrocarbon liquid.

Another agent that improves moisture resistance is a mixture of a silicone and a terpene compound. An exemplary silicone is Tego Protect- 5000 functionalized silicone fluid sold by Evonik Tego Chemie GmbH. Exemplary terpene compounds contemplated for use include terpene compounds that are a solid at room temperature, a liquid at room temperature, and/or have a molecular weight of less than about 2000 g/mol, about 1000 g/mol, about 500 g/mol, or about 200 g/mol. In certain embodiments, the terpene compound is limonene. In certain embodiments, the agent that improves moisture resistance is a mixture of Tego Protect- 5000 functionalized silicone fluid and limonene.

In certain embodiments, the agent that improves moisture-resistance is a polymer agent that improves moisture-resistance, a wax agent that improves moisture-resistance, or a mixture thereof. In certain other embodiments, the agent that improves moistureresistance is a silicone, a siloxane, a fluorinated polyol, a fluoroalkyl phosphate ester, a fluoroalkyl carboxylic ester, a salt of a fluoroalkanoic acid, a wax that improves moistureresistance, or a mixture thereof. In certain other embodiments, the agent that improves moisture-resistance is a wax that improves moisture-resistance, such as a mixture of hydrophobic hydrocarbons, water-based emulsions containing hydrophobic hydrocarbons dispersed therein, a fluoroalkylphosphate wax, a fluorinated hydrocarbon wax, or a fluoroalkyl functionalized wax. In certain other embodiments, the agent that improves moisture-resistance is a silicone, a siloxane, a fluorinated polyol, a fluoroalkyl phosphate ester, or a fluoroalkyl carboxylic ester. In certain other embodiments, the agent that improves moisture-resistance is a silicone, a siloxane, a fluorinated polyol, a fluoroalkyl phosphate ester, a fluoroalkyl carboxylic ester, a salt of a fluoroalkanoic acid, or a mixture thereof. In certain other embodiments, the agent that improves moisture- resistance is a silicone, a siloxane, a fluorinated polyol, a fluoroalkyl phosphate ester, a fluoroalkyl carboxylic ester, or a wax that improves moisture-resistance. In certain other embodiments, the agent that improves moisture-resistance is a fluorinated polyol, a silicone, a siloxane, or wax that improves moisture-resistance. In yet other embodiments, the agent that improves moisture-resistance is a mixture comprising hydrophobic hydrocarbons.

The term "fluoroalkyl phosphate ester" as used herein refers to a compound comprising a phosphate group bonded to at least one fluoroalkyl group, such as represented by P(O)(OR ¹ )(OR ² )2, wherein R ¹ is a fluoroalkyl group, and R ² represents independently for each occurrence hydrogen, alkyl, fluoroalkyl, aryl, aralkyl, heteroalkyl, heteroaryl, heteroaralkyl, an alkali metal, ammonium, or a quaternary amine, or two occurrences of R ² are taken together to form an alkaline earth metal. pH Modulator

The pH modulator can be an acid or base. In certain embodiments, the pH modulator is an alkali hydroxide (e.g., sodium hydroxide or calcium hydroxide), an alkali metal salt of a carboxylate organic compound (e.g., an alkali metal salt of citrate, such as di-sodium citrate) or an amine (e.g., ethyleneamine, diethyleneamine, methylamine, ethanolamine, triethylamine...).

The pH modulator can be a metal oxide, advantageously chosen from the group consisting of MgO, CaO, K2O, NazO, SrO, or a mixture thereof, and more advantageously MgO.

Preferably, pH modulator implemented in the present invention is an alkali hydroxide such as sodium hydroxide or a metal oxide, such as MgO. In this preferred embodiment, the alkali hydroxide can be added to the liquid part of the adhesive composition and the metal oxide can be added to the solid part of the adhesive composition of the invention.

Composite-Release Promoter

The two-part adhesive composition of the present invention advantageously does not stick to metal press plates. However, the composite-release promoter acts to facilitate release of certain wood composites from certain press apparatus used to make the composite. In the absence of a composite-release promoter, certain composites may stick to the press apparatus, making it difficult to separate the composite from the press apparatus. The composite-release promoter solves this problem by facilitating release of the wood composite. Exemplary composite-release promoters include silicones (e.g., silicones described above), fatty acids, a salt of a fatty acid, waxes, and amide compounds. Exemplary fatty acids or salts thereof include a C10-25 alkanoic acid, a salt of a C10-25 alkanoic acid, a Cio-2s alkenoic acid, a salt of an C -25 alkenoic acid; e.g., stearic acid, zinc stearate, lauric acid, oleic acid or a salt thereof (such as an alkali metal salt of oleic acid, such as potassium oleate). It is understood that a mixture of two or more of the aforementioned exemplary composite-release promoters can also be used in the adhesive compositions herein. An exemplary amide compound is N,N'-ethylenebisstearamide. Exemplary waxes include those described above for the agent that improves moisture resistance, and in particular, Hexion EW-58H; E Square 165 Amber Petroleum Macrocrystalline Wax commercially available from Baker Hughes, Inc.; and Masurf FS 115 Emulsion (28% Solids) commercially available from Mason Chemical Company.

In certain embodiments, the composite-release promoter is a silicone.

Further, in certain embodiments, a composite-release promoter is present in the final composite at a weight percent in the range of about 0.01 % (w/w) to about 5% (w/w), about 0.01% (w/w) to about 2% (w/w) or about 0.01 % (w/w) to about 1 % (w/w).

Amine- or amide-based additive

Amine- or amide-based additives are described in the literature and are contemplated to be amenable to the present invention. These additives present at least one amine group and/or at least one amide group. Different amine- or amide-based additives have different reactivity profiles, and a amine- or amide-based additive (e.g., H2NC(O)NH2, Me2NC(O)NH2, or CH3CH2NH2) can be selected to optimize the performance properties of the adhesive composition and/or binder composition formed by the adhesive. Accordingly, in certain embodiments, the amine- or amide-based additive has the formula RNH2, R2NH, RC(O)NH ₂ , R(H)C(O)NH ₂ , R ₂ NC(O)NH ₂ , or R(H)C(O)N(H)R, wherein R represents independently for each occurrence H, alkyl, aryl, or aralkyl. In certain embodiments, the amine- or amide-based additive has the formula RN(H)C(O)N(H)R, wherein R represents independently for each occurrence H, alkyl, aryl, or aralkyl. In certain other embodiments, the amine- or amide-based additive is H ₂ NC(O)NH ₂ , H ₂ NC(O)N(H)Me, MeN(H)C(O)N(H)Me, H ₂ NC(O)N(CH ₃ ) ₂ , CH ₃ C(O)NH ₂ , CH ₃ CH ₂ C(O)NH ₂ , CH ₃ NH ₂ , CH ₃ CH ₂ NH ₂ , (CH ₃ ) ₂ NH or (CH ₃ CH ₂ ) ₂ NH.

The term "alkyl" as used herein refers to a saturated straight or branched hydrocarbon, such as a straight or branched group of 1-12, 1-10, or 1-6 carbon atoms, referred to herein as C1-C12 alkyl, C1-C10 alkyl, and Ci-Ce alkyl, respectively. Exemplary alkyl groups include, but are not limited to, methyl, ethyl, propyl, isopropyl, 2-methyl-1 -propyl, 2- methyl-2-propyl, 2-methyl-1-butyl, 3-methyl-1 -butyl, 2-methyl-3-butyl, 2,2-dimethyl-1- propyl, 2-methyl-1-pentyl, 3-methyl-1 -pentyl, 4-methyl-1 -pentyl, 2-methyl-2-pentyl, 3- methyl-2-pentyl, 4-methyl-2-pentyl, 2,2-dimethyl-1-butyl, 3,3-dimethyl-1-butyl, 2-ethyl-1- butyl, butyl, isobutyl, t-butyl, pentyl, isopentyl, neopentyl, hexyl, heptyl, octyl, etc.

The term "aryl" as used herein refers to refers to a mono-, bi-, or other multi- carbocyclic, aromatic ring system. Unless specified otherwise, the aromatic ring is optionally substituted at one or more ring positions with substituents selected from alkanoyl, alkoxy, alkyl, alkenyl, alkynyl, amido, amidino, amino, aryl, arylalkyl, azido, carbamate, carbonate, carboxy, cyano, cycloalkyl, ester, ether, formyl, halogen, haloalkyl, heteroaryl, heterocyclyl, hydroxyl, imino, ketone, nitro, phosphate, phosphonato, phosphinato, sulfate, sulfide, sulfonamido, sulfonyl and thiocarbonyl. The term "aryl" also includes polycyclic ring systems having two or more cyclic rings in which two or more carbons are common to two adjoining rings (the rings are "fused rings") wherein at least one of the rings is aromatic, e.g., the other cyclic rings may be cycloalkyls, cycloalkenyls, cycloalkynyls, and/or aryls. Exemplary aryl groups include, but are not limited to, phenyl, tolyl, anthracenyl, fluorenyl, indenyl, azulenyl, and naphthyl, as well as benzo-fused carbocyclic moieties such as 5, 6,7,8- tetrahydronaphthyl. In certain embodiments, the aryl group is not substituted, i.e., it is unsubstituted.

The term "aralkyl" as used herein refers to an aryl group having at least one alkyl substituent, e.g. aryl-alkyl-. Exemplary aralkyl groups include, but are not limited to, arylalkyls having a monocyclic aromatic ring system, wherein the ring comprises 6 carbon atoms. For example, "phenylalkyl" includes phenylC4 alkyl, benzyl, 1 -phenylethyl, 2- phenylethyl, etc.

Preferably, the amine- or amide-based additive is H2NC(O)NH2 (urea) or hexamethylenetetramine (also known as hexamine), more preferably urea.

The amount of amine- or amide-based additive in the adhesive formulation can adjusted to optimize the performance properties of the adhesive composition and/or binder composition formed by the adhesive. In certain embodiments, the mole ratio of amine- or amide-based additive to amine-based azetidinium-functional cross-linker is at least about 0.1 : 1 , at least about 0.5:1 , at least about 1 : 1 , at least about 2:1 , at least about 3: 1 , at least about 4:1 or at least about 5:1. In certain embodiments, the mole ratio of amine- or amide- based additive to amine-based azetidinium-functional cross-linker is in the range of from about 0.01 :1 to about 0.5:1 , from about 0.5:1 to about 5:1 , or from about 1 :1 to about 4:1. In still other embodiments, the mole ratio of amine- or amide-based additive to amine-based azetidinium-functional cross-linker is at least 0.05:1. In still other embodiments, the mole ratio of amine- or amide-based additive to amine-based azetidinium-functional cross-linker is at least 5:1.

In certain embodiments, the amine- or amide-based additive is present in an amount from about 1 % to about 50% (w/w), from about 1 % to about 30% (w/w), from about 1 % to about 20% (w/w), from about 5% to about 50% (w/w), from about 5% to about 30% (w/w), from about 5% to about 20% (w/w), from about 10% to about 50% (w/w), from about 10% to about 30% (w/w) or from about 10% to about 20% (w/w) of the adhesive composition. In certain other embodiments, the formaldehyde scavenging agent is present in an amount from about 1% to about 50% (w/w) of the adhesive composition. In still other embodiments, the formaldehyde scavenging agent is present in an amount from about 2% to about 30% (w/w) of the adhesive composition.

Fire Retardant

Exemplary fire retardants include, for example, (i) phosphoric acid or a salt thereof, such as a mono-ammonium phosphate, di-ammonium phosphate, ammonium poly - phosphate, melamine phosphate, guanidine phosphate, urea phosphate, alkali metal phosphate, and alkaline earth metal phosphate, (ii) a halogenated phosphate compound, (iii) a phosphate ester, such as tri-o-cresyl phosphate and tris(2,3-dibromopropyl) phosphate, (iv) a chlorinated organic compound, such as a chlorinated hydrocarbon or chlorinated paraffin, (iv) a brominated organic compound, such as a brominated hydrocarbon, bromo-bisphenol A, tetrabromobisphenol A (TBBPA), decabromobiphenyl ether, octabromobiphenyl ether, tetrabromobiphenyl ether, hexabromocyclododecane, bis(tetrabromophthalimido) ethane, tribromophenol, andbis(tribromophenoxy) ethane, (v) a brominated oligomer or brominated polymer, such as TBBPA polycarbonate oligomer, brominated polystyrene, and TBBPA epoxy oligomer, (vi) a borate compound, such as an alkali metal borate, ammonium borate, or mixture comprising one or more of borax, boric acid, boric oxide, and disodium octoborate, (vii) aluminium materials, such as aluminium trihydrate and aluminium hydroxide, (viii) an alkaline earth metal hydroxide, such as magnesium hydroxide, (ix) an alkali metal bicarbonate, such as sodium bicarbonate, (x) an alkaline earth metal carbonate, such as calcium carbonate, (xi) antimony trioxide, (xii) hydrated silica, (xiii) hydrated alumina, (xiv) dicyandiamide, (xv) ammonium sulfate, and (xvi) a mixture of guanylurea phosphate and boric acid, such as those described in International Patent Application Publication No. WO 02/070215, (xvii) graphite, (xviii) melamine, and (xix) a phosphonate compound, such as diethyl-N,N-bis(2-hydroxyethyl) aminoethyl phosphonate; dimethyl-N,N-bis(2-hydroxyethyl) aminomethyl phosphonate; dipropyl-N,N-bis(3-hydroxypropyl) aminoethyl phosphonate; and dimethyl-N,N-bis(4- hydroxybutyl) aminomethyl phosphonate, such as described in U.S. Patent No. 6,713, 168.

In certain embodiments, the fire retardant is (i) phosphoric acid or a salt thereof, such as a mono-ammonium phosphate, di-ammonium phosphate, ammonium poly -phosphate, melamine phosphate, guanidine phosphate, urea phosphate, alkali metal phosphate, and alkaline earth metal phosphate, (ii) a phosphate ester, such as tri-o-cresyl phosphate and tris(2,3- dibromopropyl) phosphate, aluminium trihydrate and aluminium hydroxide, (iii) an alkaline earth metal hydroxide, such as magnesium hydroxide, (iv) an alkali metal bicarbonate, such as sodium bicarbonate, (v) antimony trioxide, or (vi) hydrated alumina.

In certain other embodiments, the fire retardant is Colemanite (CaB ₃ O4(OH)3 - H ₂ O). Wood Preservative

Exemplary wood preservatives include, for example, (i) chromated copper arsenate (CCA), (ii) alkaline copper quaternary, (iii) copper azole, (iv) a borate preservative compound, (v) a sodium silicate-based preservative compound, (vi) a potassium silicate- based preservative compound, (vii) a bifenthrin preservative compound, (viii) a coal-tar creosote, (ix) linseed oil, (x) tung oil, and (xi) an insecticide, such as an organochloride compound, organophosphate compound, carbamate compound, pyrethroid, neonicotinoid, and ryanoid.

Carbohydrate

Carbohydrates include monosaccharides, oligosaccharides (such as disaccharides), polysaccharides, starch or dextrin.

Starch can be for example potato starch, wheat starch, tapioca starch, cassava starch, rice starch, corn starch, waxy corn starch. It can also be starch ester, hydroxy ethylated or hydroxypropylated starch, carboxymethyl starch, cationic or anionic starch.

In particular, carbohydrates include monosaccharides such as glucose, fructose, galactose; disaccharides such as sucrose, lactose, lactulose, cellobiose, xylobiose, tetrahalose, maltose; amino sugars such as galactosamine, glucosamine and chitobiose; sugar acids such as aldonic acids, uronic acids and aldaric acids; oligosaccharides such as gluco-oligosaccharide, fructo-oligosaccharides; polysaccharides such as chitin, chitosan; carbohydrate syrups such as glucose syrup, corn syrup, high fructose corn syrup, high maltose corn syrup, sweet sorghum syrup, maple syrup, birch syrup, fruit syrups, invert syrups; by products of sugar refineries such as molasses, treacle and golden syrup; and/or products of hydrolysis or condensation of polysaccharides.

Preferably, the additive is a pH modulator and/or an amine- or amide-based additive and/or a metal oxide as described above, in particular, an alkali hydroxide, such as sodium hydroxide and/or a metal oxide, such as MgO, and/or urea. Preferably, when the adhesive composition comprises an alkali hydroxide and/or an amine- or amide-based additive (such as urea), these additives are present into the liquid part of the adhesive composition implemented in the present invention. When the adhesive composition comprises a metal oxide, this additive is present into the solid part of the adhesive composition implemented in the present invention.

Advantageously, in the process for preparing an article according to the invention, the weight ratio of the amine-based azetidinium-functional cross-linker / lignocellulosic material (dry weight I dry weight) is comprised between 0.2% and 10%, preferably, between 0.5% and 5%, more preferably, between 0.6% and 1.5%.

Advantageously, in the process for preparing an article according to the invention, the weight ratio of diluent / lignocellulosic material (dry weight / dry weight) is comprised between 0.5% and 12%, preferably, between 1% and 6%, more preferably, between 1% and 4%.

Advantageously, in the process for preparing an article according to the invention, the weight ratio of the ground Helianthus or Brassica meal / lignocellulosic material (dry weight / dry weight) is comprised between 0.5% and 20%, preferably, between 1.0% and 10%, more preferably, between 3% and 6%.

Advantageously, the weight ratio of urea / lignocellulosic material (dry weight / dry weight) is comprised between 0% and 6%, preferably, between 0.5% and 4%, more preferably, between 1% and 2%.

In a specific embodiment, the adhesive composition consists of:

- a solid part consisting of ground Helianthus and/or Brassica meal, preferably ground Helianthus meal, having a granulometry d50 of less than 300 pm, and optionally at least one additive, preferably urea and/or chitosan,

- a liquid part consisting of an amine-based azetidinium-functional cross-linker, a diluent, water and optionally at least one additive, identical to or different from the at least one additive in the solid part, if present.

The ground Helianthus or Brassica meal, preferably ground Helianthus meal, the amine-based azetidinium-functional cross-linker, the diluent and the optional additive(s) are as described above. In particular, the optional additive is preferably an alkali hydroxide such as sodium hydroxide, and/or urea and is advantageously present in the liquid part. In another particular, the optional additive is preferably a metal oxide such as MgO and is advantageously present in the solid part.

Contrary to the term “comprising”, it is understood that the terms "consisting of" exclude the presence of any other additional compound.

Advantageously, the liquid part of the adhesive composition is added to the lignocellulosic material (or to the mixture of the lignocellulosic material and the solid part of the adhesive composition) by applying by spraying.

Advantageously, the solid part of the adhesive composition is added to the lignocellulosic material (or to the mixture of the lignocellulosic material and the liquid part of the adhesive composition) through a hopper.

In a preferred embodiment, in the process for preparing an article according to the invention, step ii) and/or step Hi) are carried out under mixing, preferably, steps ii) and iii) are carried out under mixing, more preferably, mixing is continued at least 2 min after step iii), even more preferably, at least 5 min after step iii).

In another embodiment, the process according to the invention further comprises a mixing step after step ii) and/or iii), preferably, after steps ii) and iii). Preferably, the mixing step is carried out during at least 2 min, even preferably, at least 5 min.

Advantageously, the process according to the invention does not comprise a drying step of the liquid part of the adhesive composition before step iii). Preferably, the process according to the invention does not comprise a drying step of the liquid and solid parts of the adhesive composition before obtaining the lignocellulosic material impregnated with the adhesive composition.

By “drying step”, it is intended a heating step at a temperature of at least 40°C, preferably, at least 50°C, more preferably, at least 60°C.

Advantageously, the process for preparing an article according to the invention further comprises a step of curing the adhesive composition.

Preferably, the curing is implemented by heating at a curing temperature comprised between 120°C and 250°C, more preferably, between 150°C and 230°C, even more preferably, between 180°C and 210°C. Preferably, the article is provided after placing the lignocellulosic material impregnated with the adhesive composition into a mold, followed by pressing and heating at the curing temperature described before. Preferably, upon curing, the adhesive composition forms a solid binder.

Advantageously, the process for preparing an article according to the invention further comprises a pressing step of the lignocellulosic material impregnated with the adhesive composition.

Preferably, the pressing factor is comprised between 2 s/mm and 50 s/mm, more preferably, between 4 s/mm and 30 s/mm, even more preferably, between 6 s/mm and 15 s/mm. It is understood that the unit “s/mm" refers to the pressing time in seconds with respect to the thickness of the lignocellulosic material impregnated with the adhesive composition. For example, a pressing factor of 10 s/mm and a thickness of 12 mm mean that the pressing time is carried out during 120 s.

Preferably, the process according to the invention further comprises both the curing and pressing steps described before.

More preferably, the curing and pressing steps are performed simultaneously.

Even more preferably, the article is provided after placing the lignocellulosic material impregnated with the adhesive composition into a mold, followed by pressing and heating at the curing temperature described before.

The invention also relates to an article as described above (preferably oriented strand board or particleboard) obtained by the process according to the invention as described above.

The invention will be better understood in the light of the following examples, given by way of illustration, with reference to:

- Figure 1 is diagrams illustrating the mechanical properties of particle boards obtained from different methods (Tests 1 , 2 and 3) and pressed at different press factors;

- Figure 2 is a diagram illustrating the tack of particle boards obtained from different methods (Tests 1 , 2 and 3);

- Figure 3 is diagrams illustrating the mechanical properties of particle boards obtained from different methods (Tests 4a and 4b) and pressed at different press factors;

- Figure 4 is a diagram illustrating the tack of particle boards obtained from different methods (Tests 4a and 4b);

- Figure 5 is diagrams illustrating the mechanical properties of particle boards obtained with different raw material constituting the solid part of the 2-part adhesive composition: ground sunflower meal (Example 6) or ground rapeseed meal (Example 7);

- Figure 6 is a diagram illustrating the tack on wood particles glued with different raw material constituting the solid part of the 2-part adhesive composition: ground sunflower meal (Example 6) or ground rapeseed meal (Example 7).

Example 1 : Materials and methods of all the examples (unless otherwise specified) Materials

The plant based raw materials used in this study are solvent (hexane)-extracted sunflower (Helianthus annuus) meal, provided by Saipol (France) in pellet shape (protein content: 34.45% wt on dry matter; oil content: 0.9%wt on dry matter).

Protein content of sunflower meal was obtained using Kjeldahl procedure (NF EN ISO 5983-2 : 2009) with a nitrogen-to-protein conversion factor of 6.25.

The oil was extracted with a Soxhlet extractor using n-hexane as solvent. Thereafter the hexane was separated from oil by using a rotary evaporator at 68°C.

Sunflower meal was first ground at the desired particle size d10 = 5 pm; d50 = 30 pm; d90 = 110 m with an impact mill grinder including a classifier from Hosokawa, model 200ZPS. The final dry content of the micronized sunflower meal was 93%. The ground materials were then kept in closed containers.

The particle size of ground samples is measured using a Malvern laser granulometer Mastersizer 3000. Sample material is injected through the dry injection tool of the analyzer. Refractive index and model used are respectively 1.52 and Mie to determine the particle size density profile.

Two polyamidoamine-epichlorohydrin (PAE) resins were used : Soyad CA 1920 from Solenis (Wilmington, Delaware) or Marenyl WPD 20 from Mare SpA (Milan, Italia). These PAE resins are aqueous solutions with a polymer solids content of 20% wt/wt.Crude vegetable glycerine with a glycerol content of about 85% wt/wt was provided by Saipol (France) and used as a reactive diluent agent.

Distilled vegetable glycerine with a glycerol content of at least 99.5% wt/wt was provided by Oleon (France) and also used as a reactive diluent agent.

Urea is a technical grade with urea content of at least 97% wt/wt supplied by YARA France.

The wood particles used for board manufacturing are industrial wood particles supplied by Linex and they contain around 50% recycled wood . These particles were dried beforehand in an oven in order to obtain a moisture content of about 4 parts ATRO. They were then stored in airtight containers to avoid re-humidity.

Dry content determination

The material is placed in an aluminum cup with an amount of about 1.5 g. The exact weight is measured with an analytical balance with 4 digits after the decimal point. Then the cup is placed in a fan ventilated oven at 105°C for 3 h. Fan & valve aperture are set at 100% to accelerate water evaporation. Dry content is obtained by measuring the weight of the cup after being removed from the oven immediately or after conditioning in a desiccator to get sample at room temperature. Calculation of dry content is obtained by the calculation of material loss thanks to (1) and (2): ^m i _oss = m ₀ - m ₁ (1) wherein mo and mi are respectively the weight of the cup before being placed in the oven and after being placed in the oven.

DC% = 1 - ^mioss (2) msample wherein DC%, mioss and m _S am _P ie are respectively the dry content, the weight of material loss and the weight of sample tested (m ₀ - m _CU p).

An alternative method consists in using a moisture analyzer (Imai UM2000-LTE) to get the dry content or the moisture content. It enables to have the “atro” mode (i.e. moisture content in weight parts overdry composition) required for wood-based panel manufacturing. This method is also faster (i.e. few minutes versus 3 h) but allows to test only one sample per round. The moisture analyzer is preferably used for wood moisture content determination prior to wood panel making.

Viscosity measurement

The viscosity of the adhesive compositions (liquid part) was measured by using a rheometer (Haake MARS 40 by Thermo Scientific) equipped with a Peltier heating/cooling system. The measurement device was a plate/plate system (20 mm diameter, 1 mm gap). Measurement was done with a dynamic mode (shear rate of 10 s ^-1 , 50% shear and 20°C temperature). The viscosity value was automatically determined after 5 min of measurement using Rheowin Job manager version 4.81.0000 (Haake Mess Tech, Germany).

Panel characterization

Particle boards (600 mm x 600 mm) were cut to get samples for water resistance, Internal Bond (IB) and flexural test. Flexural, Water resistance and IB were done respectively following standard ISO EN 310:1993, ISO EN 317:1993 and ISO EN 319:1993 to get Modulus of Rupture (MOR), Modulus of Elasticity (MOE), Thickness Swelling (TS) after 24 h in water bath, and Internal Bond (IB). Apparatus used for all these measurements was the Imai (Italia), IBX700 model. The test results are mean values with their standard deviation.

To evaluate the MOE and MOR, four test specimens with nominal dimensions of 300 mm x 50 mm x 12 mm were cut from wood particle boards. The MOE and MOR of these samples were determined by a static, three point bending test and the values were calculated and recorded for each specimen.

To determine the internal bond strength and the thickness swell, eight test specimens with nominal dimensions of 50.0 mm x 50.0 mm x 12 mm were cut from test panels for each condition. The IB was calculated and recorded after each specimen was tested to failure. The TS that is defined as the percentage increase in the thickness of a specimen after immersing in water for 24 h at room temperature were measured, before and immediately after the 24 h soaking process.

Tack

Tack, also known as green strength, is the ability of the unset and uncured but formed or shaped composite to hold its shape and remain cohesive from the time the composite is formed or shaped to the time it is set-up or cured or hardened. This is an important property in the manufacture of wood-based panels and in the current process.

Tack was measured and thus defined, by forming a composite structure and testing its integrity. A 200 mm x 200 mm x 200 mm wood forming box was placed on a metal platen below it and between the platen and the box was a thin pliable plastic sheet. The wood forming box was filled with 350 g of impregnated wood from the Examples below. Then, the wood forming box was delicately removed and impregnated wood, or mat, was cold pressed for 30 seconds at a pressure of 0.5 metric tons (MeT) using a CARVER hot press (platen of 250 mm x 250 mm) with a press platen at ambient temperature (no heating). The mat was then removed without disturbing the shaped structure. After pressing, the platen, the plastic and the mat were moved to a table. The edge of the platen was aligned with the edge of the table. The formed impregnated wood, which was riding on the plastic, was then slowly pushed on above the void. The push on the mat was done at a steady rate of about 1 cm/sec. As each mat was pushed on above the void, it reached a point at which it cannot support its own weight. The mat extending off the end of the table will break off and fall. The distance a sample extends off the end of the table before breaking off was taken as a measure of tack. Measurements were taken for each side of the mat (left and right). The longer a sample extends above the void, the higher the tack, that is, the more integrity it has. Two samples were measured for each test (two values per sample, on the right and left of the mat) and the retained value is an average of the 4 measurements. Samples are compared to get a relative effect.

Example 2: Manufacturing process including drying step (comparative example)

Components of the adhesive compositions were first mixed in a 5 L bucket. Depending on the test, all three components (micronized sunflower meal, crude vegetable glycerine (comprising glycerol) and PAE with a pH adjustment at 8) can be mixed together (Test 1 ; Table 1), or a dispersion of sunflower meal was mixed separately from the blend of “PAE + crude vegetable glycerine at pH 8” (Test 2; Table 1). Adhesive compositions were mixed using a deflocculating blade for five to ten minutes. For each test, the pH of the part containing PAE cross-linker was adjusted at 8 thanks to addition of a NaOH solution (10 mol/L). The whole liquid adhesive solution (Test 1) or only a dispersion of sunflower meal (Test2) was first injected onto wood particles into a particle blender (Imai, Lab Glue Blender 300) using a spray nozzle. The mixing step was carried out for 5 min for each blend.

After mixing, the dry content of the blends was controlled by using a moisture analyzer (Imai UM2000-LTE). The wood mixtures containing high humidity level were then dried using an oven (France ETUVES, XXL 4.5) at 60°C. The moisture content after drying step depended on the test. For Test 1 (Table 1), the blend was dried until obtaining a humidity of 12.5 parts in “ATRO” mode (/.e. moisture content in weight parts over 100 weight parts of dry blend). However, if only the dispersion of sunflower meal was added (Test 2), the blend was dried until a humidity of 4 parts in “ATRO” mode. After the drying step, the blends (wood particles with liquid adhesive solution or dispersion of sunflower meal) were got out of the oven and stored in a closed container.

The dried blend according to the Test 2 (Table 1) underwent an additional step. A liquid part composed of “crude vegetable glycerin + PAE at pH 8” was injected into the wood/sunflower meal blend by using a spray nozzle into the blender. Water was added separately to target a final humidity of the blend at 12.5 parts ATRO. The mixing was carried out for 5 min. The moisture (humidity) of the blend was then measured by using a moisture analyzer.

Finally, 3010 g of impregnated particles was weighted to achieve a density of boards approximately of 650 kg/m ³ . Forming box size was 600 mm x 600 mm x 200 mm to make the mat. After wood/adhesive sample addition, the mat was cold pressed by hand. The mat was then placed into a heating press from Imai (Italia) (platen of 1000 mm x 1000 mm), pressed to a thickness of 12 mm and cured at 210°C. 4 panels were made for each test with different press times: 8, 10, 12 and 15 s/mm (/.e. 96, 120, 144 and 180 s). After pressing, thickness and weight of the particle boards were measured and recorded. Then the boards were placed in a conditioning room at 20°C and 65% r.h. (relative humidity) for at least three days.

Table 1 : Adhesive injection steps implementing a drying step

Example 3: Manufacturing process with a 2-step solid and liquid adhesive addition

The liquid part, consisting of a mixture of PAE Soyad™ CA1920 and crude vegetable glycerin was obtained after mixing into a 5 L bucket for five minutes. The pH of the liquid was then adjusted to reach the value of 8 using a NaOH solution (10 mol/L). The adequate quantity of ground sunflower meal (named the solid part) was then added as described below.

The wood particles were placed in a particle blender (Imai, Lab Glue Blender 300) and the required quantity of water to reach the targeted moisture content of the batch is sprayed using a spray nozzle into the blender on wood particles. Then, the liquid part of the adhesive composition was added to wood particles by injection during 9 min using a spray nozzle into the blender during particle mixing. Finally, the solid ground sunflower meal part was added mechanically (by hand) in the particle blender through an aperture. The mixing step was carried on for 5 min. The moisture content of the blend was then measured by using a moisture analyzer (Imai UM2000-LTE).

Finally, 3010 g of impregnated particles were weighted to reach a density of approximately 650 kg/m ³ . Forming box size was 600 mm x 600 mm x 200 mm to make the mat. After wood/adhesive sample addition, the mat was cold pressed by hand. The mat was then placed into a heating press (Imai, Italia, platen of 1000 mm x 1000 mm), pressed to a thickness of 12 mm and cured at 210°C. 4 panels were made for this Test 3 with different press times: 8, 10, 12 and 15 s/mm (/.e. 96, 120, 144 and 180 s). After pressing, thickness and weight of the particle boards were controlled. Then the boards were placed in a conditioning room at 20°C and 65% r.h. for three days.

Table 2: Adhesive injection steps without a drying step and using a biphasic adhesive

Example 4: Influence of the order of addition of liquid and solid parts in the manufacturing process with a 2-step solid and liquid adhesive addition

For all conditions, the liquid part, consisting of a mixture of PAE Soyad™ CA1920 and crude vegetable glycerin was obtained after mixing into a 5 L bucket for 5 min. The pH of the liquid was then adjusted to reach the value of 8 using a NaOH solution (10 mol/L). The adequate quantity of ground sunflower meal (named the solid part) was then added as described below (Tables 3 and 4, Tests 4a and 4b).

In Test 4a, the wood particles were placed in a particle blender (Imai, Lab Glue Blender 300) and the required quantity of water to reach the targeted moisture content of the batch is sprayed using a spray nozzle into the blender on wood particles. Then, the liquid part of the adhesive preparation was added to wood particles by injection during 9 min using a spray nozzle into the blender during particle mixing. Finally, the solid ground sunflower meal part was added mechanically (by hand) in the particle blender through an aperture. The mixing step was carried on for 5 min. The moisture content of the blend was then measured by using a moisture analyzer (Imai U M2000-LTE).

In Test 4b, the wood particles were placed in a particle blender (Imai, Lab Glue Blender 300) and the required quantity of water to reach the targeted moisture content of the batch is sprayed using a spray nozzle into the blender on wood particles. Contrary to Test 4a, the solid ground sunflower meal part was then added mechanically (by hand) in the particle blender through an aperture to the wood particles. Finally, the liquid part of the adhesive composition was added to wood particles by injection during 9 min using a spray nozzle into the blender during particle mixing. The mixing step was carried on for 5 min. The moisture content of the blend was then measured by using a moisture analyzer (Imai UM2000-LTE). Finally, 3010 g of impregnated particles prepared according to Test 4a or 4b were weighted to achieve a density of approximately 650 kg/m ³ respectively. Forming box size was 600 mm x 600 mm x 200 mm to make the mat. After wood/adhesive sample addition, the mat was cold pressed by hand. The mat was then placed into a heating press (Imai, Italia, platen of 1000 mm x 1000 mm), pressed to a thickness of 12 mm and cured at 210°C. 4 panels were made for each test with different press times: 6, 8, 10 and 12 s/mm (/.e. 72, 96, 120 and 144 s). After pressing, thickness and weight of the particle boards were controlled. Then the boards were placed in a conditioning room at 20°C and 65% r.h. for three days.

Table 3: Adhesive injection steps: liquid part then solid part

Table 4: Adhesive injection steps: solid part then liquid part Example 5: Properties of the adhesive compositions and particle boards

In order to produce a wood based panel adhesive composition with the three raw materials (sunflower meal, crude vegetable glycerin and PAE cross-linker Soyad™ CA1920), a first solution (comparative example) was to mix them all. But by doing that, a thick, very viscous mixture was obtained (200 000 mPa.s). This mixture was too viscous to be sprayed with the nozzles currently used for the injection of a binder for a wood-based panel. So, this mixture needs to have lower viscosity (e.g. below 1000 mPa. s) to be sprayable. Water was added to this mixture to improve the mixture flow (Example 2, Test 1, Table 1). The viscosity reached 375 mPa.s. In this case, when this adhesive preparation was added to the wood particles, the water part of impregnated wood particles was too high causing an overpressure phenomenon during the hot-pressing step of the panel. Indeed, the water part obtained was 17.5 parts ATRO and the highest target was 12.5 parts ATRO. To limit the excess of water, impregnated wood particles with formulation from Example 2 (Test 1 , Table 1) were dried in an oven to reach a targeted water part of 12.5 parts ATRO.

The second process of adhesive application (comparative example) consisted in an injection of a ground sunflower meal dispersion into wood particles, a drying step and an addition of reactive liquid material (Example 2, Test 2, Table 1). The viscosity of the sunflower meal dispersion was 215 mPa.s, so had a viscosity that enabled to be sprayed through industrial nozzles. However, the wood/sunflower meal blend had moisture (humidity) of 22.6 parts ATRO. After drying step and injection of water and the liquid part, the desired moisture of 12.5 parts ATRO was reached.

The third method (Example 3, Table 2; process according to the invention) consisted in addition of extra water in wood particles in order to reach the targeted moisture content of the blend, then a mixture of crude vegetable glycerin and Soyad™ CA1920 is sprayed into wood particles. Finally, the solid ground sunflower meal part is added mechanically (by hand) in the particle blender through an aperture. The mixture of crude vegetable glycerin and Soyad™ CA1920 (under the form of an aqueous solution with a polymer solid content of 20% wt/wt) has a viscosity of 140 mPa.s. This way enabled to add this raw material without extra water from ground sunflower meal dispersion, such as for Tests 1 and 2. No drying step was required because no water was added during this powder addition.

Mechanical characterizations (Internal Bond, Modulus of Rupture, Modulus of Elasticity) and water resistance with Thickness Swelling tests in water of panels from Tests 1 , 2 and 3 are shown in Figure 1 .

First of all, for the mechanical performances (Internal Bonding, Modulus of Rupture and Modulus of Elasticity), higher is the value, better is the final board. On the contrary, concerning the Thickness Swelling test of boards immerged in water for 24 h, lower is the value, better is the water resistance of the board. As observed for these 4 parameters, a trend can be established for boards of the 3 tests: boards from Test 1 showed the lowest performances whereas, surprisingly, boards from Test 3 had the best performances for press factors of 6 s/mm and 8 s/mm, meaning that the system has a better kinetic of curing. Moreover, wood-based panels from Test 3 were the only panels to reach and exceed the required performances to achieve the P2 standard (EN 312:2010) at a press factor of 10 s/mm. The P2 standard (EN 312:2010) is, for a 12 mm thick panel, IB greater than 0.4 N/mm ² , MOR greater than 11.0 N/mm ² and MOE greater than 1800 N/mm ² .

An evaluation of tack on wood particles glued according to Tests 1 , 2 and 3 was conducted and results are shown in Figure 2.

The same trend was observed as for the mechanical performances: surprisingly formulation from Test 3 showed the best tack performances whereas formulation from Test 1 had the lowest tack performances. Thus, the 2-step solid and liquid adhesive addition enabled better tack than a process including a drying step.

Another aspect of the present invention is an improvement of the visual sedimentation of ground sunflower meal within the final wood-based panel. Indeed, when processes including a drying step (Tests 1 and 2) were applied to manufacture wood-based panels, a sedimentation phenomenon was observed. It means that a greater amount of ground sunflower meal was observed in the underside of panels than on the upper face. In the case of Test 3, this phenomenon was slightly observed, and even less when glycerol was added to the formulation (included in crude vegetable glycerin). When glycerol was added (as crude vegetable glycerin), a homogeneous mixture was obtained with increased tack properties.

Another studied parameter was the addition order of both the liquid and solid parts, and its influence on board properties. Test 4a consisted in the addition of the liquid part in wood particles in the first step, followed by the solid part addition (it has to be noted that Test 3 and Test 4a are the same tests but carried out at a different time and with different batches of the raw materials ; this explains the variability of the results between the two tests). In Test 4b, the solid part was first added to the wood particles, then the liquid part was added. Mechanical characterizations (Internal Bond, Modulus of Rupture, Modulus of Elasticity) and water resistance with Thickness Swelling tests in water of panels from Tests 4a and 4b are shown in Figure 3.

Concerning the internal bonding test, standard deviations of both Tests 4a and 4b are overlaid on each other, that means no difference can be confirmed. For water resistance test (TS), no difference can be made between Tests 4a and 4b at press factors of 6, 8 and 10 s/mm. At 12 s/mm, a better water resistance is obtained for Test 4a (i.e. lower TS), especially as standard deviations are not overlaid. Flexural tests (MOR and MOE) cannot help decide between Test 4a and 4b. For press factor at 8, 10 and 12 s/mm, values are similar and standard deviations are overlaid. A difference can be observed at 6 s/mm: panels from Test 4b had a better performance, especially as standard deviations are not overlaid. Finally, these results showed that both additional protocols can be processed without clearly impacting final mechanical performances and water resistance of wood particle boards. An evaluation of tack on wood particles glued according to Examples 4a and 4b was also conducted and results are shown in Figure 4.

Unlike the previous properties, a difference of tack performances can be observed between Tests 4a and 4b. Indeed, a better tack is obtained when the liquid part is added first in the 2-step solid and liquid adhesive addition (Test 4a).

Examples 6 and 7: Manufacturing process with a 2-step liquid and solid adhesive addition of particle boards using ground sunflower or rapeseed meal

Adhesive preparation and particle board manufacturing

Ground sunflower meal (Example 6) or ground rapeseed meal (Example 7) were used for the manufacture of particle boards according to the invention. Mechanical properties were investigated.

Solvent-extracted sunflower meal and rapeseed meal were provided by Saipol (France), in pellet form. Total crude proteins content of sunflower meal and rapeseed meal were respectively 34,5% wt and 35% wt, calculated on dry matter. Both raw materials were first ground at lab scale to achieve the desired particle size of 30 pm (d10 = 5 m; d50 = 30 pm; d90 = 110 pm as a standard) by using the lab grinder from Retsch model ZM 200. The final dry content of the micronized raw materials was around 93%.

The liquid part, consisting of a mixture of 29.5 g of PAE CA1920, 13.9 g of crude glycerol, and 12.2 g of urea was obtained after mixing into a beaker for 5 min. The pH of the liquid was then adjusted to reach the value of 8 using a NaOH solution (10 mol/L).

The solid part consisting of 31.4 g of ground sunflower or rapeseed meal was prepared separately.

614 g of wood particles were placed in a planetary blender (Pluton, Minneapolis) with a paste impeller. 26.4 g of water was added to the wood before the adhesive in order to achieve a moisture content of 12% for glued particles. Then, the liquid part of the 2-part adhesive composition was first added to wood particles with a syringe during particles mixing. Finally, the ground raw material (solid part) was introduced mechanically (by hand) in the blender. The mixing step was carried on for 5 min. The humidity of the blend was measured by using a moisture analyzer (Imai UM2000-LTE).

A 200 mm x 200 mm x 200 mm wood forming box was filled with impregnated wood (wood+adhesive+water) sample weighed to achieve a particle board with a density of 650 kg/m ³ at a thickness of 12 mm (final thickness was obtained thanks to a stainless-steel mold of 12 mm thick). Then, impregnated wood was cold pressed by hand to form a mat. The mat was hot pressed to a thickness of 12 mm for 3 min at a press platen temperature of 180°C. Then the particle board was placed in a conditioning room at 20°C and 65% r.h. for at least one day. For each adhesive composition, 2 boards were made. Results and Discussions

Ground sunflower meal and ground rapeseed meal were tested as the solid part of the 2-part adhesive composition. Mechanical characterizations (internal bond, modulus of rupture, modulus of elasticity) and water resistance with thickness swelling tests in water of panels from these examples are shown in Figure 5. Boards made with ground sunflower meal had a higher average performance than boards made with ground rapeseed meal regarding internal bonding and thickness swelling. But a different trend was observed for flexural tests. Ground rapeseed meal showed better modulus of rupture and elasticity than ground sunflower meal. However, both examples showed statistically similar properties due to standard deviation recovery for all properties. Ground sunflower meal and ground rapeseed meal are considered to bring similar mechanical and water resistance properties to wood particles panels.

An evaluation of tack on wood particles glued according to this manufacturing process was also conducted. The results are shown in Figure 6. No modification on tack properties were observed between ground sunflower meal and ground rapeseed meal.

Example 8-15: Influence of the particle size of sunflower meal

Mechanical properties of particle boards manufactured using ground sunflower meal according to the invention or defibrated sunflower meal were compared. Adhesive preparation and wood particles board manufacturing are described below.

Sunflower meal was comminuted following two different processes. According to the first one, sunflower meal was ground (micronized) at lab scale by using the lab grinder from Retsch model ZM 200 at the following particle size : d10 = 9.5 m; d50 = 80 pm; d90 = 375 pm. The obtained material is called “ground sunflower meal”. The dry content of the ground sunflower meal was 93%. The second process is a defibrating process using an Andritz disc refiner with reference D2B505 discs as described in application WO2021/069689. The defibration of sunflower meal was carried out in atmospheric conditions without heating the material. The throughput was 60 kg/h. The obtained material is called “defibrated sunflower meal”. The defibrated sunflower meal achieved the particle size of: d10 = 95 pm; d50 = 430 pm; d90 = 820 pm. Its dry content was 89%.

In Examples 8 and 9, the liquid part, consisting of a mixture of 43.9 g of PAE resin Marenyl WPD 20 and 17.7 g of distilled glycerin was obtained after mixing into a beaker for five minutes. The pH of the liquid was then adjusted to reach the value of 11 using a NaOH solution (10 mol/L). 25.0 g of ground or defibrated sunflower meal (corresponding to the solid part) was also prepared separately.

606 g of wood particles were placed in a planetary blender (Pluton, Minneapolis) with a paste impeller. The ground sunflower meal (solid part of the 2-part adhesive composition) was first introduced mechanically (by hand) in the blender. Then, the liquid part was added to wood particles with a syringe during particles mixing. Finally, water was added to the wood before the adhesive in order to achieve a moisture content of 11 % for glued particles. The mixing step was carried on for 5 min. The humidity of the blend was measured by using a moisture analyzer (Imai UM2000-LTE).

Particle boards were manufactured as described in Examples 6-7, except that the mat was hot pressed to a thickness of 12 mm for2 or 3 min. For each adhesive composition, 2 boards were made.

In Examples 10 and 11, the same protocol was executed. The only difference was the quantity of added ground sunflower meal (corresponding to the solid part). 37.6 g of ground sunflower meal was thereby prepared separately.

In Examples 12 to 15, the same protocol was executed except that ground sunflower meal was replaced by defibrated sunflower meal.

Results and Discussions

Ground and defibrated sunflower meal were tested as the solid part of the 2-part particles board adhesive composition. Mechanical characterization (internal bonding) and water resistance with thickness swelling test after 24 h in water of panels are shown in the following Table 5.

Table 5: mechanical performances obtained with ground or defibrated sunflower meal

When comparing the panels made according to the same process under the same conditions but using ground sunflower meal according to the invention (Examples 8-11) or defibrated sunflower meal (Examples 12-15), a better performance was observed in all conditions for panels made with ground sunflower meal, for both mechanical and water resistance tests, whatever the press time and the quantity of added sunflower meal.

Examples 16-17: Effect of blending chitosan (additive) with the solid part of the 2-part adhesive composition on the adhesive performances Adhesive preparation and particle board manufacturing

In Example 16, the liquid part, consisting of a mixture of 23.9 g of PAE resin Marenyl WPD 20 and 17.7 g of distilled glycerin was obtained after mixing into a beaker for 5 min. The pH of the liquid was then adjusted to reach the value of 11 using a NaOH solution (10 mol/L). 25.0 g of ground sunflower meal (corresponding to the solid part) was also prepared separately.

In Example 17, the same procedure as in Example 16 was conducted, except that 3 g of powdered chitosan was mixed into solid part with the ground sunflower meal. Chitosan, characterized by a low molecular weight (in the range of 50 000-190 000 Da) with a degree of deacetylation > 95% and a dry matter > 90%, was purchased from PRIMEX EHF.

For both Examples 16 and 17, 606 g of wood particles were placed in a planetary blender (Pluton, Minneapolis) with a paste impeller. The solid part (ground sunflower meal + chitosan) was first introduced mechanically (by hand) in the blender. Then, the liquid part of the 2-part adhesive composition was added to wood particles with a syringe during particles mixing. Finally, water was added to the wood before the adhesive in order to achieve a moisture content of 11% for glued particles. The mixing step was carried on for 5 min. The humidity of the blend was measured by using a moisture analyzer (Imai UM2000- LTE).

Particle boards were manufactured as described in Examples 6-7.

Results and Discussions

Mechanical properties were evaluated on boards prepared with or without powdered chitosan blended with the ground sunflower meal. Results are shown in Table 6 below.

Table 6: mechanical performances of particle board manufactured with or without chitosan blended with the solid part

Blending chitosan (used as an additive) with the solid part allowed to increase the adhesive properties of the 2-part adhesive composition.