Title:
PROCESSING DEVICE AND METHOD FOR FORMING CONNECTION CONDUCTORS FOR SEMICONDUCTOR COMPONENTS
Document Type and Number:
WIPO Patent Application WO/2018/178292
Kind Code:
A3
Abstract:
The invention relates to a processing device for forming connection conductors for semiconductor components, in particular for producing a periodic structure, which device comprises a forming unit for forming at least one connection conductor. The invention is characterized in that the processing device comprises an advancing unit which is designed to move the connection conductors and the forming unit relative to one another in a direction of advance, and in that the forming unit has at least one step element, at least one forming element which can be moved relative to the step element, and a forming-element moving unit for moving the forming element relative to the stop element, the forming element, stop element and forming-element moving unit being designed to cooperate such that the connection conductor can be bent by moving the forming element between the stop element and the forming element by means of the forming-element moving unit. The invention further relates to a method for forming connection conductors for semiconductor components.
Inventors:
RENDLER LI CARLOS (DE)
Application Number:
PCT/EP2018/058197
Publication Date:
December 06, 2018
Filing Date:
March 29, 2018
Export Citation:
Assignee:
FRAUNHOFER GES FORSCHUNG (DE)
International Classes:
H01L31/18; B21D13/10; H01L31/05
Domestic Patent References:
| WO2008080160A1 | 2008-07-03 |
Foreign References:
| EP2466648A1 | 2012-06-20 | |||
| DE19915488A1 | 2000-10-12 | |||
| EP2704213A1 | 2014-03-05 |
Attorney, Agent or Firm:
LEMCKE, BROMMER & PARTNER, PATENTANWÄLTE PARTNERSCHAFT MBB (DE)
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