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Title:
PROCESSING DEVICE AND PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/153219
Kind Code:
A1
Abstract:
This processing device that processes a substrate is provided with: a substrate holding part having a substrate holding surface that suctions and holds the substrate; and an outer edge washing part that washes an outer edge part of the substrate holding surface. In addition, this processing method for processing the back surface of the substrate using the processing device includes: processing the back surface of the substrate in a state where the front surface of the substrate is suctioned and held by the substrate holding surface of the substrate holding part; and washing the outer edge part of the substrate holding surface.

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Inventors:
IKEUE KAZUYA (JP)
Application Number:
PCT/JP2020/001241
Publication Date:
July 30, 2020
Filing Date:
January 16, 2020
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
B24B55/06; H01L21/304; H01L21/683
Domestic Patent References:
WO2019013042A12019-01-17
Foreign References:
JP2002124501A2002-04-26
JP2003045845A2003-02-14
JP2015092520A2015-05-14
JPH08316293A1996-11-29
JP2014124731A2014-07-07
JP2007314880A2007-12-06
JP2010003816A2010-01-07
JP2013069776A2013-04-18
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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