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Patent Searching and Data


Title:
PROCESSING METHOD AND PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/105444
Kind Code:
A1
Abstract:
This processing method of one embodiment is a method for a processing device that carries out film forming processing for forming a metal film on a substrate accommodated in a processing container, using the ALD method or the CVD method, such methods using an organic metal compound. The processing method includes: a step for determining whether the standby time of the processing device is at least a set time which has been pre-set; and a step for carrying out conditioning processing on the processing container if the standby time is at least the set time.

Inventors:
SUZUKI MIKIO (JP)
ISHIZAKA TADAHIRO (JP)
Application Number:
PCT/JP2019/043619
Publication Date:
May 28, 2020
Filing Date:
November 07, 2019
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
C23C16/52
Domestic Patent References:
WO2010061603A12010-06-03
WO2009119627A12009-10-01
Foreign References:
JP2007165479A2007-06-28
JP2018024927A2018-02-15
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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