Title:
PROCESSING METHOD AND PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/166668
Kind Code:
A1
Abstract:
Provided is a method for processing a substrate with a processing device, the method involving: performing a first polishing step on the substrate with a first polishing unit; performing a second polishing step on the substrate with a second polishing unit; performing a first re-polishing step on the substrate with the first polishing unit; and performing a second re-polishing step on the substrate with the second polishing unit, wherein a finish-polishing is performed to a final finishing thickness in the second re-polishing step.
Inventors:
SAKAUE TAKASHI (JP)
Application Number:
PCT/JP2021/004173
Publication Date:
August 26, 2021
Filing Date:
February 04, 2021
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
B24B7/00; B24B49/02; H01L21/304
Domestic Patent References:
| WO2020012951A1 | 2020-01-16 | |||
| WO2019124032A1 | 2019-06-27 |
Foreign References:
| JPH07124857A | 1995-05-16 | |||
| JP2005313297A | 2005-11-10 | |||
| JPH09174394A | 1997-07-08 | |||
| JP2001237202A | 2001-08-31 | |||
| JP2015039739A | 2015-03-02 | |||
| JP2015008247A | 2015-01-15 | |||
| JP2013119123A | 2013-06-17 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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