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Title:
PROCESSING METHOD FOR LAMINATE MEMBER, PROCESSED LAMINATE MEMBER, AND GAS BARRIER FILM
Document Type and Number:
WIPO Patent Application WO/2015/182203
Kind Code:
A1
Abstract:
 Provided is a processing method for a laminate member (100) that is provided with a first sheet (10), and a second sheet (20) arranged on one surface of the first sheet (10), wherein the first sheet (10) is provided with a base material (11) and a gas barrier film (12) laminated to at least one surface of the base material (11), the surface hardness of the gas barrier film (12), measured using a Nano Indenter, being 10 GPa or above, and the surface hardness of the second sheet (20) on the surface thereof on the opposite side from that facing the first sheet (10) being 0.05 GPa or above, wherein the processing method for the laminate member (100) includes a cutting step for carrying out a mechanical cutting process of the laminate member (100) from the surface on the second sheet (20) side, to obtain a processed laminate member (100) provided with a cut first sheet (10) and a cut second sheet (20). According to this processing method, the gas barrier layer is not susceptible to cracking.

Inventors:
FUCHI EMI (JP)
NAGANAWA SATOSHI (JP)
Application Number:
PCT/JP2015/056508
Publication Date:
December 03, 2015
Filing Date:
March 05, 2015
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
B32B38/18; B26D3/00; B26D7/08; B32B9/00; B32B27/00
Domestic Patent References:
WO2013147090A12013-10-03
WO2011108438A12011-09-09
Foreign References:
JP2012040625A2012-03-01
JP2010228391A2010-10-14
JP2009291845A2009-12-17
JP2011201080A2011-10-13
JP2002331493A2002-11-19
JP2007299487A2007-11-15
JP2010076028A2010-04-08
JP2012097128A2012-05-24
Attorney, Agent or Firm:
HAYAKAWA, Yuzi et al. (JP)
Yuji Hayakawa (JP)
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