Title:
PROCESSING UNIT AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/117324
Kind Code:
A1
Abstract:
The present invention suppresses an increase in the footprint of a substrate processing device and improves the processing efficiency of a processing unit of the substrate processing device. A dressing unit used for the substrate processing device includes: a dresser shaft (51) disposed so as to oppose a polishing pad (352) for polishing a substrate; a plurality of dressers (50-1, 50-2) for holding a plurality of dressing members (50-1a, 50-2a) which are arranged concentrically via arms (410) about the axis of the dresser shaft (51); an air cylinder for driving the plurality of dressers (50-1, 50-2) in a direction approaching or going away from the polishing pad (352); and a folding mechanism (450) configured to be capable of adjusting the angle of the arms (410) such that the plurality of dressers (50-1, 50-2) approach each other.
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Inventors:
YOSHIDA ATSUSHI (JP)
KASHIWAGI MAKOTO (JP)
ISHII YU (JP)
KASHIWAGI MAKOTO (JP)
ISHII YU (JP)
Application Number:
PCT/JP2020/038243
Publication Date:
June 17, 2021
Filing Date:
October 09, 2020
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B53/017; B24B37/34; B24B55/06; H01L21/304
Foreign References:
US5989103A | 1999-11-23 | |||
JP2000070875A | 2000-03-07 | |||
JP2004106084A | 2004-04-08 | |||
JPH07130692A | 1995-05-19 | |||
JP2018058197A | 2018-04-12 | |||
JP2005136068A | 2005-05-26 | |||
JP2019117185A | 2019-07-18 |
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
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