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Title:
PRODUCTION METHOD FOR ADHESIVE LAYER-EQUIPPED OPTICAL LAMINATE HAVING THROUGH-HOLE, AND THROUGH-HOLE FORMING DEVICE USED IN SAID PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2021/192443
Kind Code:
A1
Abstract:
Provided is a method with which can be produced an adhesive layer-equipped optical laminate having a through-hole and for which the loss of glue and the lifting off of a separator and a surface protection film have been suppressed. According to an embodiment of the present invention, the production method for the adhesive layer-equipped optical laminate having a through-hole comprises stacking a plurality of adhesive layer-equipped optical laminates to form a workpiece, and forming the through-hole at a predetermined position on the workpiece by cutting using an end mill. The adhesive layer-equipped optical laminate comprises an optical film, an adhesive layer disposed one side of the optical film, a separator adhered temporarily onto the adhesive layer in a releasable manner, and a surface protection film adhered temporarily onto the other side of the optical film in a releasable manner. The formation of the through-hole comprises pressing the end mill against an end surface of the hole and cutting, along with blowing air from the opposite direction to the direction in which swarf from the endmill is discharged during cutting.

Inventors:
MUNEMOTO JUNJI (JP)
NAKAICHI MAKOTO (JP)
YAMAMOTO YUKI (JP)
Application Number:
PCT/JP2020/046318
Publication Date:
September 30, 2021
Filing Date:
December 11, 2020
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
B23C3/00; B23C9/00; B23Q11/00; G02B5/30
Domestic Patent References:
WO2018016285A12018-01-25
Foreign References:
JP6622439B12019-12-18
JPH11197928A1999-07-27
JPH09262710A1997-10-07
JP2019018308A2019-02-07
JP2004034170A2004-02-05
US10112202B12018-10-30
Attorney, Agent or Firm:
MOMII Takafumi (JP)
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