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Patent Searching and Data


Title:
PRODUCTION METHOD FOR SMART CARD, SMART CARD, AND CONDUCTIVE PARTICLE-CONTAINING HOT-MELT ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2021/246484
Kind Code:
A1
Abstract:
Provided are: a production method that is for a smart card and that can impart excellent connection reliability and bending resistance to the smart card; a smart card; and a conductive particle-containing hot-melt adhesive sheet. According to the present invention, a conductive particle-containing hot-melt adhesive sheet that contains solder particles of an amorphous alloy in a binder containing a crystalline polyamide having a carboxyl group is interposed between, and thermocompression bonded to, a card member (10) and an IC chip (20). The crystalline polyamide having a carboxyl group can improve the solder wettability of the amorphous alloy to obtain excellent connection reliability. This is considered to be attributed to the flux effect of the carboxyl group existing in the crystalline polyamide, and, as a result, it becomes possible to prevent reduction in the elastic modulus of an adhesive layer caused by addition of a flux compound, and to obtain excellent bending resistance.

Inventors:
ODAKA RYOSUKE (JP)
SEKIGUCHI MORIO (JP)
KUMAKURA HIROYUKI (JP)
ABE TOMOYUKI (JP)
Application Number:
PCT/JP2021/021183
Publication Date:
December 09, 2021
Filing Date:
June 03, 2021
Export Citation:
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Assignee:
DEXERIALS CORP (JP)
International Classes:
G06K19/077; B42D25/305; B42D25/455; B42D25/46; B42D25/47; C09J5/06; C09J7/35; C09J9/02; C09J11/04; C09J167/00; C09J177/00; G06K19/02
Foreign References:
JP2011233550A2011-11-17
JP2017117468A2017-06-29
JP2020077870A2020-05-21
JP2020098845A2020-06-25
JP2021093294A2021-06-17
JP2017117468A2017-06-29
JP5964187B22016-08-03
Other References:
See also references of EP 3975049A4
Attorney, Agent or Firm:
NOGUCHI, Nobuhiro (JP)
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