Title:
PROTECTION MEMBER FOR SEMICONDUCTOR, PROTECTION COMPOSITION FOR INKJET COATING-TYPE SEMICONDUCTOR, AND METHOD FOR PRODUCING SEMICONDUCTOR APPARATUS USING SAME, AND SEMICONDUCTOR APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/196776
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a protection member which is for a semiconductor and has excellent pattern retention at high temperatures and moisture resistance and has good adhesion to a semiconductor circuit, etc. for long period of time. The protection member which is for a semiconductor and solves said problem, includes a cured article of an organic polymerizable compound having a functional group containing an oxygen atom and/or a nitrogen atom. The absolute value of the difference between the linear expansion coefficient at 150°C of the cured article and the linear expansion coefficient at 25°C of the cured article is 55 or less.
Inventors:
YAMADA YASUHARU
SHIRAISHI TAKUMI
TOMITA YUSUKE
YAMAMOTO YUGO
SHIRAISHI TAKUMI
TOMITA YUSUKE
YAMAMOTO YUGO
Application Number:
PCT/JP2020/013766
Publication Date:
October 01, 2020
Filing Date:
March 26, 2020
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
H01L21/312; B41J2/01; C08G59/02; C08G59/20; C08K5/5415; C08L63/00; C08L71/00; C09D11/101; C09D11/30; C09D163/00; H01L21/56; H01L23/29; H01L23/31
Domestic Patent References:
| WO2014034507A1 | 2014-03-06 | |||
| WO2017094584A1 | 2017-06-08 | |||
| WO2018147247A1 | 2018-08-16 |
Foreign References:
| JP2014148586A | 2014-08-21 | |||
| JP2006199790A | 2006-08-03 | |||
| JP2018055019A | 2018-04-05 |
Attorney, Agent or Firm:
WASHIDA & ASSOCIATES (JP)
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