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Patent Searching and Data


Title:
PROTECTIVE FILM-FORMING COMPOSITION, METHOD FOR FORMING PROTECTIVE FILM, AND LAMINATE INCLUDING PROTECTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2016/136557
Kind Code:
A1
Abstract:
Provided is a protective film-forming composition for forming a protective film that covers a stepped substrate having a structure of protrusions and recesses. The protective film-forming composition contains a resin (A), a first solvent (B1) having a boiling point lower than 180°C, and a second solvent (B2) having a boiling point of 180°C or higher.

Inventors:
YONEKUTA YASUNORI (JP)
SHIBUYA AKINORI (JP)
KOJIMA MASAFUMI (JP)
YAMAMOTO HISAO (JP)
TOMIGA TAKAMITSU (JP)
IWATA MITSURU (JP)
Application Number:
PCT/JP2016/054586
Publication Date:
September 01, 2016
Filing Date:
February 17, 2016
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C09D201/00; C08L101/02; C09D7/12; C09D125/00; H01L21/265
Foreign References:
JP2005181353A2005-07-07
JP2003003120A2003-01-08
JP2010222503A2010-10-07
JPH08130247A1996-05-21
Attorney, Agent or Firm:
KURATA, Masatoshi et al. (JP)
Masatoshi Kurata (JP)
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