Title:
PROTECTIVE SHEET, ELECTRONIC DEVICE PACKAGE, AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/095697
Kind Code:
A1
Abstract:
Provided is a protective sheet that is for a circuit substrate, that has a first surface and a second surface on the opposite side from the first surface, and in which the adhesive strength of the first surface as measured in a probe tack test is at most 0.15 N/cm2, an index X calculated by formula 1 is 0.5-2.0, and the contained amount of a filler is 1.0-9.8 wt%. [Formula 1] X = Ftotal/Ttotal (when the protective sheet is formed into a rectangle having a size of 0.5 cm × 1.0 cm and the projective sheet is heated and pressed at 180°C and 1 MPa for 5 minutes, Ftotal represents the average (μm) of flow lengths at four sides at portions having the greatest flow, and Ttotal represents the total thickness (μm) of the protective sheet).
Inventors:
MATSUO TAMAKI (JP)
MATSUDO KAZUNORI (JP)
KISHI DAISUKE (JP)
HINO MITSUHARU (JP)
MATSUDO KAZUNORI (JP)
KISHI DAISUKE (JP)
HINO MITSUHARU (JP)
Application Number:
PCT/JP2022/042570
Publication Date:
June 01, 2023
Filing Date:
November 16, 2022
Export Citation:
Assignee:
TOYO INK SC HOLDINGS CO LTD (JP)
TOYOCHEM CO LTD (JP)
TOYOCHEM CO LTD (JP)
International Classes:
H05K3/28; B32B27/00; H01L23/29; H01L23/31; H05K9/00
Domestic Patent References:
WO2015083491A1 | 2015-06-11 | |||
WO2017010228A1 | 2017-01-19 | |||
WO2020184545A1 | 2020-09-17 |
Foreign References:
JP2020069720A | 2020-05-07 | |||
JP2013136821A | 2013-07-11 | |||
JP2012059743A | 2012-03-22 |
Attorney, Agent or Firm:
RYUKA & PARTNERS (JP)
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