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Patent Searching and Data


Title:
PROTECTIVE SHEET, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/101170
Kind Code:
A1
Abstract:
The present invention provides a protective sheet or the like comprising: a protective layer that contains a water-soluble polymer compound; and a base material layer that overlaps one surface of the protective layer. The glass transition point of the base material layer is 200°C or higher.

Inventors:
SHISHIDO YUICHIRO (JP)
SATO SATOSHI (JP)
HABU TAKASHI (JP)
Application Number:
PCT/JP2023/038683
Publication Date:
May 16, 2024
Filing Date:
October 26, 2023
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
B32B27/30; B32B27/34; H01L23/12
Domestic Patent References:
WO2022201858A12022-09-29
WO2023042840A12023-03-23
Foreign References:
JP2021161735A2021-10-11
JP2019114795A2019-07-11
JP2015050268A2015-03-16
JP2014080507A2014-05-08
JP2006218687A2006-08-24
Attorney, Agent or Firm:
FUJIMOTO & PARTNERS (JP)
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