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Patent Searching and Data


Title:
PROTRUSION MECHANISM FOR MOLDING DIE, AND MOLDING DIE WITH SAID PROTRUSION MECHANISM
Document Type and Number:
WIPO Patent Application WO/2018/096692
Kind Code:
A1
Abstract:
Provided are: a protrusion mechanism for a molding die, which enables reliable die removal and which is compact; a movable die and/or a stationary die which is provided with the protrusion mechanism; and a molding die. Provided is a protrusion mechanism for a molding die for molding a molded product 10 using a stationary die 12 and a movable die 21. The protrusion mechanism is provided with: a protrusion pin 43 using the spring reaction force of a spring 51 as the drive source; the spring 51, which causes the protrusion pin 43 to protrude; and a holder 55 mounted to an ejector plate 72 and accommodating the spring 43. The spring 51 is mounted within the holder 55 so as to cause the protrusion pin 43 to protrude, and the holder 55 limits the amount of extension of the accommodated spring 43 to within a predetermined range.

Inventors:
SORIMOTO MASANORI (JP)
Application Number:
PCT/JP2016/085254
Publication Date:
May 31, 2018
Filing Date:
November 28, 2016
Export Citation:
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Assignee:
TECHNOCRATS CORP (JP)
International Classes:
B29C43/50; B29C33/44; B29C45/26; B29C45/44
Foreign References:
JP2014097628A2014-05-29
JP2002172641A2002-06-18
Attorney, Agent or Firm:
SENTOKUIN,Hiroshi (JP)
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