Title:
PURE COPPER PLATE, COPPER/CERAMIC BONDED BODY, AND INSULATED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2021/177460
Kind Code:
A1
Abstract:
This pure copper plate has a composition which has a Cu content of 99.96 mass% or more and a total content of Ag, Sn and Fe of not less than 9.0 mass ppm but less than 100.0 mass ppm, with the balance being made up of unavoidable impurities, while having an average crystal grain size of the crystal grains in a rolled surface of 10 μm or more. This pure copper plate has crystals that have the (022) plane, the (002) plane, the (113) plane, the (111) plane or the (133) plane as a crystal plane that is parallel to the rolled surface; and the diffraction peak intensities of these crystal planes as determined by X-ray diffractometry by means of a 2θ/θ method with respect to the rolled surface satisfy I(022)/(I(022) + I(002) + I(113) + I(111) + I(133)) ≤ 0.15, I(002)/I(111) ≥ 10.0 and I(002)/I(113) ≥ 15.0.
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Inventors:
MATSUNAGA HIROTAKA (JP)
ITO YUKI (JP)
MORI HIROYUKI (JP)
ITO YUKI (JP)
MORI HIROYUKI (JP)
Application Number:
PCT/JP2021/008809
Publication Date:
September 10, 2021
Filing Date:
March 05, 2021
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C22C9/00; C22F1/00; C22F1/08
Domestic Patent References:
| WO2018181593A1 | 2018-10-04 | |||
| WO2020122112A1 | 2020-06-18 | |||
| WO2021060023A1 | 2021-04-01 |
Foreign References:
| JP2018024930A | 2018-02-15 | |||
| JPS62282797A | 1987-12-08 | |||
| JP2020038764A | 2020-03-12 | |||
| JPH062058A | 1994-01-11 |
Other References:
See also references of EP 4116450A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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