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Patent Searching and Data


Title:
RADIANT PANEL
Document Type and Number:
WIPO Patent Application WO/2022/123718
Kind Code:
A1
Abstract:
[Problem] To provide a radiant panel used in radiation cooling/heating air conditioning, said radiant panel having excellent cooling/heating effects, condensation being unlikely to form in areas other than a heat dissipation part, and the generated condensate being adequately processable. [Solution] This radiant panel A that is one example of a radiant panel applying the present invention comprises a heat dissipation part 1, two column structures 2, and an upper louver 3 and lower louver 4. Each column structure 2 is constituted from a vertical frame body 20 and a vertical frame cover 21 that can be attached to and detached from the vertical frame body 20. A condensation receiver 5 is positioned on the lower part of piping 10 (and a fin part 11), and on the back-surface side of the lower louver 4. Moreover, the condensation receiver 5 is positioned at a height position corresponding to a second-level louver piece 40, among three louver pieces 40, in the vertical direction. Furthermore, the condensation receiver 5 is disposed in a position toward the front-surface side in the thickness direction, namely, a position contacting the back surface of the second-level louver piece 40. Moreover, a fin back-surface heat-blocking material 90, a heat-blocking tape 91, a lower back-surface heat-blocking material 92, and a columnar heat-blocking material 93 are positioned on the back-surface side of the radiant panel A.

Inventors:
MIYAMOTO NAOYUKI (JP)
MIYAMOTO TOMONORI (JP)
FUTAEDA TAKAHARU (JP)
Application Number:
PCT/JP2020/046017
Publication Date:
June 16, 2022
Filing Date:
December 10, 2020
Export Citation:
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Assignee:
FUTAEDA CORP (JP)
International Classes:
F24F5/00; F24F13/22
Foreign References:
JP6694199B12020-05-13
JP2019132448A2019-08-08
JP2013250024A2013-12-12
JPH07120013A1995-05-12
JP2013088007A2013-05-13
JP2012141115A2012-07-26
JP2011185453A2011-09-22
Attorney, Agent or Firm:
ARIYOSHI Shuichiro et al. (JP)
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