Title:
RADIATION CURABLE RESIN COMPOSITION AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2018/021674
Kind Code:
A1
Abstract:
The present application relates to a radiation curable resin composition, and a use thereof. The present application can provide a radiation curable resin composition, which has an elastic modulus after pre-curing, is suitable for a dam and fill process, and has various physical properties such as heat resistance, adhesive strength, and cohesive force. The radiation curable resin composition can be useful for direct bonding between optical members or as a filler for an air gap.
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Inventors:
LEE SEUNG MIN (KR)
BAEK SI YEON (KR)
KIM SO YOUNG (KR)
YANG SE WOO (KR)
BAEK SI YEON (KR)
KIM SO YOUNG (KR)
YANG SE WOO (KR)
Application Number:
PCT/KR2017/005618
Publication Date:
February 01, 2018
Filing Date:
May 30, 2017
Export Citation:
Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C08F299/08; C08F2/48; C08F20/28; C08G77/20
Domestic Patent References:
| WO1996010608A1 | 1996-04-11 |
Foreign References:
| KR20150016917A | 2015-02-13 | |||
| EP1674505A1 | 2006-06-28 | |||
| US20150373838A1 | 2015-12-24 | |||
| JP5940456B2 | 2016-06-29 |
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
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