RADIATION-SENSITIVE RESIN COMPOSITION AND COMPOUND

WIPO Patent Application WO/2012/090959

A1

The purpose of the present invention is to meet the increasing demands on fine patterns in the microfabrication field, including the manufacture of integrated-circuit elements, by providing: a radiation-sensitive resin composition that not only has sufficient basic characteristics such as sensitivity and resolution but also has sufficient MEEF performance; and a compound suitable for said radiation-sensitive resin composition. The present invention is a radiation-sensitive resin composition that contains: a compound (A) that satisfies formula (1) and preferably satisfies formula (2); and a polymer (B) containing a constitutional unit that has an acid-dissociable group.

JPH0834923	BLACK PHOTOSENSITIVE RESIN COMPOSITION AND MANUFACTURE OF BLACK MATRIX
JP5068628	Photosensitive resin composition, photosensitive resin composition film, and coverlay using them.
JP6463370	Photosensitive resin composition, its dry film and cured film, and printed wiring board using them.

NAKAHARA KAZUO (JP)
MARUYAMA KEN (JP)

PCT/JP2011/080118

July 05, 2012

December 26, 2011

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JSR CORP (JP)
NAKAHARA KAZUO (JP)
MARUYAMA KEN (JP)

G03F7/004; C07C22/02; C07C309/19; C07C313/04; C07C381/12; C07D307/00; C08K5/42; C08L101/02; G03F7/039

WO2005101129A1

2005-10-27

JP2005126598A	2005-05-19
JP2002255877A	2002-09-11
JPS51112865A	1976-10-05
JP2004317907A	2004-11-11

AMANO KAZUNORI (JP)
Kazuki Amano (JP)

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