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Patent Searching and Data


Title:
RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, POLYMER, AND COMPOUND
Document Type and Number:
WIPO Patent Application WO/2021/111912
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a radiation-sensitive resin composition that exhibits a good sensitivity to exposure light and an excellent LWR performance and CDU performance, a method for forming resist patterns, a polymer, and a compound that can be used in the preceding. The present invention pertains to a radiation-sensitive resin composition comprising a polymer having a structural unit represented by formula (1) and a radiation-sensitive acid generator. In formula (1), A is an oxygen atom or sulfur atom. m + n is 2 or 3, m is 1 or 2, and n is 1 or 2. X is a C1-20 divalent organic group. R1 is an acid-dissociable group or a polar group.

Inventors:
NEMOTO RYUICHI (JP)
NISHIKORI KATSUAKI (JP)
NAKASHIMA HIROMITSU (JP)
Application Number:
PCT/JP2020/043492
Publication Date:
June 10, 2021
Filing Date:
November 20, 2020
Export Citation:
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Assignee:
JSR CORP (JP)
International Classes:
C07C271/34; C07C69/734; C07C69/75; C07C69/753; C07C69/92; C07C69/96; C07C321/18; C07D307/00; C07D307/33; C07D309/06; C07D327/06; C07D333/78; C08F20/28; C08F28/04; G03F7/038; G03F7/039; G03F7/20
Domestic Patent References:
WO2019026549A12019-02-07
WO2015012229A12015-01-29
Foreign References:
JP2015172120A2015-10-01
JP2012252244A2012-12-20
JP2000191732A2000-07-11
Attorney, Agent or Firm:
AMANO Kazunori (JP)
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