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Patent Searching and Data


Title:
RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING RESIST PATTERN
Document Type and Number:
WIPO Patent Application WO/2021/157354
Kind Code:
A1
Abstract:
The present invention provides: a radiation-sensitive resin composition capable of manifesting an adequate level of sensitivity, LWR performance, and process margins when a next-generation exposure technique is applied; and a method for forming a resist pattern. The radiation-sensitive resin composition includes: a resin including a structural unit A indicated by formula (1) and a structural unit B having an acid-cleavable group (excluding that indicated in formula (1)); a radiation-sensitive acid generator; and a solvent. (In formula (1), RX is a hydrogen atom, a fluorine atom, a methyl group, or trifluoromethyl group. A is an aromatic hydrocarbon group that has: -ORY bonded to a carbon atom adjacent to the carbon atom to which Lα is bonded; and a hydrogen atom on another carbon atom that is unsubstituted or partially or wholly substituted by a cyano group, a nitro group, an alkyl group, an alkoxy group, an alkoxy carbonyl group, an alkoxy carbonyl oxy group, an acyl group, or an acyloxy group. RY is a hydrogen atom or a protective group that is de-protected by the action of acid. Lα represents a single bond or a divalent linking group.)

Inventors:
OMIYA TAKUYA (JP)
NISHIKORI KATSUAKI (JP)
KIRIYAMA KAZUYA (JP)
KINOSHITA NATSUKO (JP)
Application Number:
PCT/JP2021/001795
Publication Date:
August 12, 2021
Filing Date:
January 20, 2021
Export Citation:
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Assignee:
JSR CORP (JP)
International Classes:
C08F12/02; C08F20/12; G03F7/004; G03F7/039; G03F7/20
Foreign References:
JP2020008842A2020-01-16
JP2008304767A2008-12-18
JP2015018072A2015-01-29
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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