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Patent Searching and Data


Title:
RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, AND POLYMER
Document Type and Number:
WIPO Patent Application WO/2021/171852
Kind Code:
A1
Abstract:
Provided are: a radiation-sensitive resin composition through which it is possible to form a resist pattern having favorable sensitivity to exposure light, exceptional LWR performance, and a wide process window; a method for forming a resist pattern; and a polymer. The radiation-sensitive resin composition comprises: a polymer component having, within the same or differing polymers, a first structural unit containing an aromatic carbon ring to which one hydroxyl group is bonded, a second structural unit containing an aromatic carbon ring to which two or more hydroxyl groups are bonded, and a third structural unit containing an acid-dissociable group dissociated by the action of an acid and imparting a carboxy group; and a radiation-sensitive acid generator.

Inventors:
NISHIKORI KATSUAKI (JP)
KIRIYAMA KAZUYA (JP)
TANIGUCHI TAKUHIRO (JP)
MARUYAMA KEN (JP)
Application Number:
PCT/JP2021/002305
Publication Date:
September 02, 2021
Filing Date:
January 22, 2021
Export Citation:
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Assignee:
JSR CORP (JP)
International Classes:
C08F12/04; C08F20/10; C08F20/52; C09K3/00; G03F7/004; G03F7/039; G03F7/20
Domestic Patent References:
WO2017029891A12017-02-23
Foreign References:
JP2019074733A2019-05-16
JP2018095851A2018-06-21
JP2000267280A2000-09-29
Attorney, Agent or Firm:
AMANO Kazunori (JP)
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