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Patent Searching and Data


Title:
RADIATION-SENSITIVE RESIN COMPOSITION, RESIST PATTERN FORMATION METHOD, AND RADIATION-SENSITIVE ACID GENERATOR
Document Type and Number:
WIPO Patent Application WO/2021/049592
Kind Code:
A1
Abstract:
Provided are a radiation-sensitive resin composition with which it is possible to form a resist pattern having excellent sensitivity to exposure light and having exceptional LWR performance and resolution, a resist pattern formation method, and a radiation-sensitive acid generator. A radiation-sensitive resin composition that contains a radiation-sensitive acid generator and a polymer having a first structural unit that contains a first acid-dissociable group dissociated by the action of an acid to yield an alkali-soluble group, the radiation-sensitive resin composition being such that the radiation-sensitive acid generator contains a compound having a sulfonate anion and a radiation-sensitive onium cation, and the sulfonate anion has a second acid-dissociable group that dissociates by the action of a (thio)acetal structure, a carbonyloxy group, and an acid to yield a carboxy group.

Inventors:
NISHIKORI KATSUAKI (JP)
KIRIYAMA KAZUYA (JP)
TANIGUCHI TAKUHIRO (JP)
MORI SHUTO (JP)
MARUYAMA KEN (JP)
Application Number:
PCT/JP2020/034375
Publication Date:
March 18, 2021
Filing Date:
September 10, 2020
Export Citation:
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Assignee:
JSR CORP (JP)
International Classes:
C07C309/17; C07C381/12; C07D317/30; C07D317/70; C07D317/72; C07D321/10; C07D327/04; C09K3/00; G03F7/004; G03F7/039; G03F7/20
Foreign References:
JP2016204370A2016-12-08
JP2019104721A2019-06-27
JP2018145185A2018-09-20
JP2014160143A2014-09-04
Attorney, Agent or Firm:
AMANO Kazunori (JP)
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