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Patent Searching and Data


Title:
RADIATION-SENSTIVE RESIN COMPOSITION AND METHOD OF FORMING RESIST PATTERN
Document Type and Number:
WIPO Patent Application WO/2020/250639
Kind Code:
A1
Abstract:
Provided are: a radiation-sensitive resin composition from which a resist pattern can be formed to have good sensitivity to exposure light, excellent LWR performance, and resolution; and a method of forming a resist pattern. The radiation-sensitive resin composition contains: a polymer having a first structural unit containing a phenolic hydroxyl group and a second structural unit represented by formula (1); and a radiation-sensitive acid generating agent containing a compound represented by formula (2).

Inventors:
NISHIKORI KATSUAKI (JP)
Application Number:
JP2020/020186
Publication Date:
December 17, 2020
Filing Date:
May 21, 2020
Export Citation:
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Assignee:
JSR CORP (JP)
International Classes:
C07C381/12; C08F220/10; C08K5/36; C08L33/04; G03F7/004; G03F7/039; G03F7/20
Foreign References:
JP2004334060A2004-11-25
JP2016080940A2016-05-16
JP2010128368A2010-06-10
JP2011242546A2011-12-01
Attorney, Agent or Firm:
AMANO Kazunori (JP)
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