RADICAL-POLYMERIZABLE RESIN, RADICAL-POLYMERIZABLE RESIN COMPOSITION, AND CURED MATERIAL THEREOF

WIPO Patent Application WO/2011/132504

A1

Disclosed is a radical-polymerizable resin that has excellent flexibility of the cured material thereof, can, when being used as an adhesive, ease stress caused by a difference in coefficients of thermal expansion arising between adhesive and adherend during heating and cooling, and can prevent detachment at the adhesive interface and breakage and the like of the adherend. The radical-polymerizable resin is a resin obtained from the radical polymerization of the compounds represented by the belowmentioned formulae 1a to 1b, and the compounds represented by the belowmentioned formulae 2a to 2f, and is characterized by being liquid at 0°C and by the weight-average molecular weight being at least 500. Each symbol within the formulae is as defined in the description.

JP2021155658	COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING CURED PRODUCT
JP7081104	A polyether polymer, a composition containing the polyether polymer, and a molded product.
JP2004292476	TWO-PHOTON ABSORPTION POLYMERIZABLE COMPOSITION AND METHOD FOR POLYMERIZING THE SAME

MAHIKO TOMOAKI (JP)
FUNAKI YOSHINORI (JP)
TSUTSUMI KIYOHARU (JP)
ARAKI NAOKO (JP)

PCT/JP2011/057634

October 27, 2011

March 28, 2011

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DAICEL CHEM (JP)
MAHIKO TOMOAKI (JP)
FUNAKI YOSHINORI (JP)
TSUTSUMI KIYOHARU (JP)
ARAKI NAOKO (JP)

C08G65/04; C08F290/14; C08F299/02

JP2005305371A	2005-11-04
JP2009235136A	2009-10-15
JP2006052278A	2006-02-23
JP2008001901A	2008-01-10

GOTO, YUKIHISA (JP)
Yukihisa Goto (JP)

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