Title:
READILY BONDABLE POLYESTER FILM
Document Type and Number:
WIPO Patent Application WO/1995/013188
Kind Code:
A1
Abstract:
A readily bondable polyester film excellent in antistatic performance, slipperiness, bondability, blocking resistance, water solubility, solvent resistance, chipping resistance, and so forth, and suitable as magnetic recording material, various photographic materials, wrapping material, electrical insulation material, general industrial materials, and so forth. This film is composed of a polyester base and, formed on at least one side thereof, a layer formed from a mixture mainly comprising a copolyester composition and oxidized wax and/or natural wax, which composition contains a polyoxyalkylene glycol component in an amount of 1 wt. % or above to less than 40 wt. %.
Inventors:
HIRATA JUN (JP)
SHIMIZU YAZO (JP)
MIMURA TAKASHI (JP)
AONO SHOUJI (JP)
SUZUKI MASARU (JP)
SHIMIZU YAZO (JP)
MIMURA TAKASHI (JP)
AONO SHOUJI (JP)
SUZUKI MASARU (JP)
Application Number:
PCT/JP1994/001276
Publication Date:
May 18, 1995
Filing Date:
August 03, 1994
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
HIRATA JUN (JP)
SHIMIZU YAZO (JP)
MIMURA TAKASHI (JP)
AONO SHOUJI (JP)
SUZUKI MASARU (JP)
HIRATA JUN (JP)
SHIMIZU YAZO (JP)
MIMURA TAKASHI (JP)
AONO SHOUJI (JP)
SUZUKI MASARU (JP)
International Classes:
B29C55/02; B29D7/01; B32B27/36; C08J7/04; (IPC1-7): B32B27/36; B29C55/12; C08J7/04
Foreign References:
| JPH05287099A | 1993-11-02 | |||
| JPS60228149A | 1985-11-13 | |||
| JPH02229838A | 1990-09-12 |
Other References:
See also references of EP 0696502A4
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