Title:
REINFORCED FIBER SUBSTRATE AND METHOD FOR MANUFACTURING SAME, SHAPING FABRIC AND METHOD FOR MANUFACTURING SAME, AND FIBER-REINFORCED PLASTIC STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2017/038697
Kind Code:
A1
Abstract:
A reinforcing fiber substrate in which a plurality of thermally bonding binders are disposed on a surface thereof, the total area of thermally bonding binders having a projected area equivalent circle diameter less than 300 times the average diameter of reinforcing fibers constituting the reinforcing fiber substrate is 10% or less of the total area of the thermally bonding fibers disposed on the surface. The reinforcing fiber substrate imparts excellent shape retention and matrix resin impregnating ability to a shaping fabric for RTM.
Inventors:
TAKANO TSUNEO (JP)
HONMA TAKASHI (JP)
HONMA TAKASHI (JP)
Application Number:
PCT/JP2016/075023
Publication Date:
March 09, 2017
Filing Date:
August 26, 2016
Export Citation:
Assignee:
MITSUBISHI RAYON CO (JP)
International Classes:
B29B15/08; B29C39/10; B29K105/08
Domestic Patent References:
| WO2013084552A1 | 2013-06-13 | |||
| WO2012066805A1 | 2012-05-24 |
Foreign References:
| JP2005213469A | 2005-08-11 | |||
| JP2009235182A | 2009-10-15 |
Other References:
See also references of EP 3345734A4
Attorney, Agent or Firm:
NOGUCHI, Takeo et al. (JP)
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