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Title:
REINFORCING FIBER MAT, AND FIBER-REINFORCED RESIN MOLDING MATERIAL AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2019/146484
Kind Code:
A1
Abstract:
A reinforcing fiber mat comprising reinforcing fiber bundles having an average fiber length of 5 to 100 mm, inclusive, the weight ratio of the bundles having 86 or more fibers in the bundle being more than 99 wt% and no more than 100 wt% of the reinforcing fiber bundles. Also, a fiber-reinforced resin molding material comprising the reinforcing fiber mat and a thermoplastic resin, and a method for producing a fiber-reinforced resin molding material including steps [A]-[D]. Provided are a reinforcing fiber mat and a fiber-reinforced resin molding material having excellent mechanical properties and fluidity during molding. [A] A step for producing a mat base material of reinforcing fiber bundles having a single yarn count per unit width of 500/mm to 1600/mm, inclusive, and a drape value of 120 to 240 mm, inclusive. [B] A step for spreading or laminating a thermoplastic resin on the mat base material. [C] A step for melting the thermoplastic resin. [D] A step for cooling and solidifying the melted thermoplastic resin between panel surfaces that are 5% or more thicker than the base material thickness at the time of complete resin impregnation.

Inventors:
SEIKE SATOSHI (JP)
TATEYAMA MASARU (JP)
FUSE MITSUKI (JP)
HIRANO HIROSHI (JP)
MATSUI AKIHIKO (JP)
URA KAZUMA (JP)
Application Number:
JP2019/001219
Publication Date:
August 01, 2019
Filing Date:
January 17, 2019
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08J5/06; D04H1/40
Domestic Patent References:
WO2017221657A12017-12-28
WO2011089929A12011-07-28
WO2013115337A12013-08-08
WO2018143067A12018-08-09
WO2016104154A12016-06-30
Foreign References:
JP2014205354A2014-10-30
JP2003127240A2003-05-08
JP2013104156A2013-05-30
JP2000141502A2000-05-23
JP2003080519A2003-03-19
JP5985085B22016-09-06
JPS5512908B11980-04-04
Attorney, Agent or Firm:
BAN Toshimitsu et al. (JP)
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