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Patent Searching and Data


Title:
REINFORCING MATERIAL AND REINFORCING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/131259
Kind Code:
A1
Abstract:
A reinforcing material (1) is provided with a resin layer (2) and a restraint layer (3) disposed on the resin layer (2). The resin layer (2) contains a thermosetting resin, a diene-based rubber, a tackifying resin, and a vulcanizing agent. The thermosetting resin contains a flexible epoxy resin. The softening temperature of the tackifying resin is 75-100°C. The bromine value of the tackifying resin is 30 gBr2/100g or more.

Inventors:
SUZUKI YUTO (JP)
IWASE TAKAYUKI (JP)
Application Number:
PCT/JP2020/038961
Publication Date:
July 01, 2021
Filing Date:
October 15, 2020
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
B32B5/00; B32B5/02; B32B7/022; B32B25/16; B32B27/38; E04C5/07
Foreign References:
JP2012076279A2012-04-19
JP2009161659A2009-07-23
JPH10140125A1998-05-26
JP2009039909A2009-02-26
JP2008030257A2008-02-14
JP2007160917A2007-06-28
JP2005041210A2005-02-17
Other References:
See also references of EP 4082767A4
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
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