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Title:
RELAY DEVICE USING CONDUCTIVE FLUID
Document Type and Number:
WIPO Patent Application WO/2007/026678
Kind Code:
A1
Abstract:
A relay device using a conductive fluid and having an excellent switching response is provided. The relay device is formed by bonding a semiconductor substrate to an insulator substrate, and mainly comprises a stacked layer body having an interior space, at least two contact points exposed to the interior space, a diaphragm portion facing the interior space, conductive fluid sealed in the interior space, and an actuator for elastically deforming the diaphragm portion. The diaphragm portion is provided on the semiconductor substrate, so that the drive force of the actuator necessary for elastically deforming the diaphragm portion can be reduced and the volume change of the interior space can be obtained with a fast response. This volume change causes the positional displacement of the conductive fluid in the interior space, thereby forming a conduction state or non-conduction state between the contact points.

Inventors:
YOKOYAMA KOJI (JP)
UOTOME RIICHI (JP)
FURUKUBO EIICHI (JP)
KAKIMOTO KATSUMI (JP)
MESHII RYOSUKE (JP)
UEDA HIDEKI (JP)
KOBAYASHI MASAKAZU (JP)
Application Number:
PCT/JP2006/316946
Publication Date:
March 08, 2007
Filing Date:
August 29, 2006
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD (JP)
YOKOYAMA KOJI (JP)
UOTOME RIICHI (JP)
FURUKUBO EIICHI (JP)
KAKIMOTO KATSUMI (JP)
MESHII RYOSUKE (JP)
UEDA HIDEKI (JP)
KOBAYASHI MASAKAZU (JP)
International Classes:
H01H57/00; H01H29/02
Foreign References:
JP2005142142A2005-06-02
JP2000195389A2000-07-14
JP2001505640A2001-04-24
JP2002219694A2002-08-06
JPS59155971A1984-09-05
JP2000349357A2000-12-15
JP2005139901A2005-06-02
JP2005215614A2005-08-11
JPS6427274A1989-01-30
Attorney, Agent or Firm:
NISHIKAWA, Yoshikiyo et al. (Umeda-Daiichiseimei Bldg. 5F,, 12-17, Umeda 1-chome, Kita-ku, Osaka-shi Osaka 01, JP)
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