Title:
RELEASE FILM AND METHOD FOR MANUFACTURING MOLDED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2023/095453
Kind Code:
A1
Abstract:
A release film (10) according to the present invention has a release layer (1) constituting at least one release surface, the release layer (1) contains 30 mass% or more of a polyester resin, and requirement 1 mentioned below is satisfied. (Requirement 1) When the modulus of storage elasticity of the release film (10) at 70ºC as measured using a dynamic viscoelasticity measurement device (tensile mode, frequency of 1 Hz, temperature increase rate of 5ºC/min) is denoted by A1, and the modulus of storage elasticity after the release film 10 has been treated at 175ºC for 120 seconds at 2 MPa is denoted by A2, the release film (10) satisfies the relationship of A2/A1 ≥ 1.2.
Inventors:
KONOIKE SHOGO (JP)
ENOMOTO YOSUKE (JP)
ENOMOTO YOSUKE (JP)
Application Number:
PCT/JP2022/037231
Publication Date:
June 01, 2023
Filing Date:
October 05, 2022
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
B32B27/00; B32B27/36; C08J5/18; H05K1/03
Foreign References:
| JP6923060B1 | 2021-08-18 | |||
| JP2017109306A | 2017-06-22 | |||
| JP2018187934A | 2018-11-29 | |||
| JP2002265665A | 2002-09-18 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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