Title:
RELEASE FILM FOR MOLDING AND MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/173682
Kind Code:
A1
Abstract:
The present invention pertains to a release film (10) for molding, which is used for molding a first resin composition with a mold, and which has a laminate structure obtained by laminating a release layer comprising a third resin composition on a base material layer comprising a second resin composition, wherein: the release layer (2) and the base material layer (1) are directly joined; the laminate structure has the release layer (2) in the outermost layer thereof; and the release layer (2) is formed by crosslinking a copolymer of a specific structure and a curing agent.
Inventors:
MATSUMOTO JUN (JP)
SHIRAISHI FUMIHIRO (JP)
SASAKI KENTA (JP)
SHIRAISHI FUMIHIRO (JP)
SASAKI KENTA (JP)
Application Number:
PCT/JP2018/007855
Publication Date:
September 27, 2018
Filing Date:
March 01, 2018
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
B29C33/68; B29C45/02; B29C45/14; B32B27/00; B32B27/30; C08J5/18
Domestic Patent References:
| WO2008020543A1 | 2008-02-21 | |||
| WO2014156722A1 | 2014-10-02 | |||
| WO2015037426A1 | 2015-03-19 |
Foreign References:
| JP2014065218A | 2014-04-17 | |||
| JP2014065219A | 2014-04-17 | |||
| JP2003261702A | 2003-09-19 | |||
| JP2012011658A | 2012-01-19 | |||
| JPH0639970A | 1994-02-15 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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