Title:
RELEASE FILM FOR SEMICONDUCTOR SEALING PROCESS AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT USING SAME
Document Type and Number:
WIPO Patent Application WO/2019/225525
Kind Code:
A1
Abstract:
[Problem] To provide a release film which is for a semiconductor sealing process and which has at least a certain level of releasability and mold followability, reduces the occurrence of wrinkles even in a high-temperature sealing process, and can be used at low cost. [Solution] This release film for a semiconductor sealing process has a surface layer (A) and a heat-resistant resin layer (B), wherein the surface layer (A) includes a 4-methylpentene-1 polymer, and the release film for a semiconductor sealing process has a storage elastic modulus (E'1) of 250-1500 MPa at 180 °C.
Inventors:
NONOSHITA SHO (JP)
SAITOH TAKESHI (JP)
FUJIWARA JUNPEI (JP)
SAITOH TAKESHI (JP)
FUJIWARA JUNPEI (JP)
Application Number:
PCT/JP2019/019825
Publication Date:
November 28, 2019
Filing Date:
May 20, 2019
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
B29C33/68; B32B27/00; B32B27/32; H01L21/56
Domestic Patent References:
| WO2015133634A1 | 2015-09-11 | |||
| WO2015133630A1 | 2015-09-11 |
Foreign References:
| JP2002158242A | 2002-05-31 | |||
| JP2011134811A | 2011-07-07 | |||
| JPH02102552A | 1990-04-16 | |||
| JP2010208104A | 2010-09-24 |
Attorney, Agent or Firm:
SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW (JP)
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