Title:
RELEASE FILM SUITABLE FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2017/199764
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a process release film which can be peeled easily and adequately from a metal surface having a high roughness, such as blackened copper foil, even after processing under harsh conditions, such as hot pressing under conditions in which the temperature and pressure, for example, are higher than in the prior art, or hot pressing for a more extended period of time. This problem is solved by means of a process release film which includes a thermoplastic resin, wherein at least one surface of the process release film has the following characteristics: (1) a film resilience value R measured using a nano-indentation method at a testing temperature of 180ºC satisfies the following formula.
R≥70 (%)
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Inventors:
SHIMIZU MASARU (JP)
SHIMA KENJI (JP)
SHIMA KENJI (JP)
Application Number:
PCT/JP2017/017226
Publication Date:
November 23, 2017
Filing Date:
May 02, 2017
Export Citation:
Assignee:
MITSUI CHEMICALS TOHCELLO INC (JP)
International Classes:
B29C33/68; C08J5/18; H05K3/46
Domestic Patent References:
| WO2004087401A1 | 2004-10-14 | |||
| WO2013021816A1 | 2013-02-14 |
Foreign References:
| JP2014098138A | 2014-05-29 | |||
| JP2009066984A | 2009-04-02 | |||
| JP2015227437A | 2015-12-17 |
Attorney, Agent or Firm:
ASAMURA PATENT OFFICE, P.C. (JP)
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