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Patent Searching and Data


Title:
REPLICA MOLD MATERIAL FOR IMPRINTING
Document Type and Number:
WIPO Patent Application WO/2019/031359
Kind Code:
A1
Abstract:
[Problem] To provide a novel replica mold material for imprinting. [Solution] An replica mold material for imprinting containing the following component (A), component (B), and component (C). (A): A di(meth)acrylate compound represented by formula (1) (in the formula, R1 and R2 each independently represent a hydrogen atom or a methyl group; R3 and R4 each independently represent an alkylene group; R5 and R6 each independently represent a hydrogen atom or a methyl group; r1 and r2 each independently represent an integer). (B): A compound having 2-4 groups represented by formula (2) (excluding the di(meth)acrylate compound represented by formula (1)) (in the formula, X represents a single bond or an alkylene group; R7 represents a hydrogen atom or a methyl group) per molecule. (C): A photopolymerization initiator.

Inventors:
KOBAYASHI JUNPEI (JP)
KATO TAKU (JP)
Application Number:
PCT/JP2018/028897
Publication Date:
February 14, 2019
Filing Date:
August 01, 2018
Export Citation:
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Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
B29C59/02; B29C33/40
Domestic Patent References:
WO2011065546A12011-06-03
Foreign References:
JP2012068376A2012-04-05
JP2016134629A2016-07-25
JP2016215460A2016-12-22
JP2010018644A2010-01-28
JP2010159369A2010-07-22
JP2014108979A2014-06-12
JP2008019292A2008-01-31
Attorney, Agent or Firm:
HANABUSA PATENT & TRADEMARK OFFICE (JP)
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