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Patent Searching and Data


Title:
RESIN ADDITIVE, RESIN COMPOSITION, AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2022/176852
Kind Code:
A1
Abstract:
The present invention provides: a resin additive capable of imparting low temperature impact properties to a resin material; a resin composition containing said resin additive; and a molded article formed from said resin composition. The resin additive according to the present invention is a polymer having a structural unit (a1) derived from a monomer (1). The resin composition according to the present invention contains the resin additive and a resin material. The molded article according to the present invention is formed from said resin composition.

Inventors:
AOKI YUTAKA (JP)
NIINO HIROSHI (JP)
OKAMOTO EIKO (JP)
NISHII HIROYUKI (JP)
UEDA MASAHIRO (JP)
IIMORI MASASHI (JP)
KUWAHARA ATSUSHI (JP)
Application Number:
PCT/JP2022/005940
Publication Date:
August 25, 2022
Filing Date:
February 15, 2022
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08F279/02; C08F220/00; C08L9/00; C08L33/06; C08L33/12; C08L101/00
Domestic Patent References:
WO2017038725A12017-03-09
Foreign References:
JP2013532767A2013-08-19
JP2014189649A2014-10-06
JP2017110070A2017-06-22
JP2017145423A2017-08-24
JPH06313016A1994-11-08
JP2015511266A2015-04-16
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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