Title:
RESIN COMPOSITE MATERIAL AND RESIN MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2021/166914
Kind Code:
A1
Abstract:
Provided are a resin composite material and a resin molded body using the same, the resin composite material containing: a thermoplastic resin; a powder which is dispersed in the thermoplastic resin and contains polysaccharides; and monosaccharides.
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Inventors:
HARA HIDEKAZU (JP)
KIM JAE KYUNG (JP)
SAKATO JIRO (JP)
HIROISHI JIROU (JP)
SUZUKI TOSHIHIRO (JP)
TAZUKE MASAMI (JP)
IKEUCHI MASATO (JP)
YAMAZAKI KYOSUKE (JP)
YABUNAKA KENTARO (JP)
KIM JAE KYUNG (JP)
SAKATO JIRO (JP)
HIROISHI JIROU (JP)
SUZUKI TOSHIHIRO (JP)
TAZUKE MASAMI (JP)
IKEUCHI MASATO (JP)
YAMAZAKI KYOSUKE (JP)
YABUNAKA KENTARO (JP)
Application Number:
PCT/JP2021/005741
Publication Date:
August 26, 2021
Filing Date:
February 16, 2021
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
B29C70/12; B29C70/28; C08K5/07; C08K5/1545; C08L1/02; C08L23/00; C08L67/02; C08L93/00; C08L101/00; B29K101/12; B29K105/12
Foreign References:
| JP2004292805A | 2004-10-21 | |||
| JP2004181881A | 2004-07-02 | |||
| JP2001032515A | 2001-02-06 | |||
| JP2000136579A | 2000-05-16 | |||
| JP2016520343A | 2016-07-14 | |||
| JP2011526535A | 2011-10-13 | |||
| JP2011505172A | 2011-02-24 | |||
| JP2010173169A | 2010-08-12 | |||
| JP2020024327A | 2020-02-13 |
Other References:
See also references of EP 4108440A4
Attorney, Agent or Firm:
IIDA & PARTNERS et al. (JP)
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