Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN COMPOSITION AND ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2023/017752
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a resin composition and an adhesive that are highly curable and have a high photocuring adhesive strength with UV light having a longer wavelength (for example, 405 nm) and that are stable with respect to ambient light. The present invention provides a resin composition comprising: (A) a (meth)acrylate compound; (B) a thiol compound; and (C) a photopolymerization initiator represented by formula (1) (in the formula, R is hydrogen or an alkyl group).

Inventors:
IKARASHI HIROTATSU (JP)
Application Number:
PCT/JP2022/029484
Publication Date:
February 16, 2023
Filing Date:
August 01, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NAMICS CORP (JP)
International Classes:
C08G75/045; C07D295/12; C09J4/02; C09J11/06; H01L21/52
Domestic Patent References:
WO2017221620A12017-12-28
WO2020080391A12020-04-23
Foreign References:
JP2016117832A2016-06-30
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
Download PDF: