Title:
RESIN COMPOSITION AND RESIN-ATTACHED COPPER FOIL
Document Type and Number:
WIPO Patent Application WO/2021/090730
Kind Code:
A1
Abstract:
Provided is a resin composition having excellent dielectric properties, high adhesiveness to low-roughness surfaces, heat resistance, and excellent water resistance. This resin composition includes (a) a polymer having a polyphenylene ether skeleton and a butadiene skeleton in one molecule and having at least one selected from the group consisting of a vinyl group, a styryl group, an allyl group, an ethynyl group, and a (meth)acryloyl group and at least one of (b) a polymer including a styrene-butadiene skeleton and (c) a polymer including a cycloolefin skeleton, and, relative to a total content of 100 weight parts of component (a), component (b), and component (c), the content of component (a) is 15-60 weight parts inclusive and the total content of component (b) and component (c) is 40-85 weight parts inclusive.
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Inventors:
OOSAWA KAZUHIRO (JP)
OGAWA KUNIHARU (JP)
MAKINO HARUKA (JP)
OGAWA KUNIHARU (JP)
MAKINO HARUKA (JP)
Application Number:
PCT/JP2020/040194
Publication Date:
May 14, 2021
Filing Date:
October 27, 2020
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
C08F299/00; B32B15/08; C08K3/013; C08K5/54; C08L53/02; C08L65/00; H05K1/03; H05K3/46
Foreign References:
| JPS5167354A | 1976-06-10 | |||
| JPS5898359A | 1983-06-11 | |||
| JPS6053554A | 1985-03-27 | |||
| JP2007254741A | 2007-10-04 | |||
| JP2009035710A | 2009-02-19 | |||
| JP2019172803A | 2019-10-10 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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