Title:
RESIN COMPOSITION, COATING LIQUID, RELEASE FILM-EQUIPPED MOLD, AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2018/003432
Kind Code:
A1
Abstract:
Provided are the following: a resin composition and coating liquid which can form a film having excellent mold release properties and excellent durability; a release film-equipped mold which is provided with a release film having excellent mold release properties and excellent durability; and a method for producing same. This resin composition contains a copolymer (A1), which has units derived from a monomer having an organic group having 1 or more fluorine atoms (however, the monomer does not have a blocked isocyanate group or an active hydrogen atom-containing functional group), units derived from a monomer having a blocked isocyanate group (however, the monomer does not have an active hydrogen atom-containing functional group) and units derived from a monomer having an active hydrogen atom-containing functional group (however, the monomer does not have a blocked isocyanate group), and a compound (B) which has 2 or more of at least 1 type of functional group selected from the group consisting of hydroxyl groups, amino groups and carboxyl groups and which has a boiling point that is not lower than the block dissociation temperature of blocked isocyanate groups in the copolymer (A1) and not higher than 400ºC.
Inventors:
OBI MASAKI (JP)
TANIGUCHI TAIHEI (JP)
TANIGUCHI TAIHEI (JP)
Application Number:
PCT/JP2017/021023
Publication Date:
January 04, 2018
Filing Date:
June 06, 2017
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
International Classes:
C08L33/16; B29C33/38; B29C33/58; C08F220/24; C08K5/04; C08K5/17; C08L27/12; C09D175/04; C09D201/04
Domestic Patent References:
| WO2010061964A1 | 2010-06-03 | |||
| WO2011062093A1 | 2011-05-26 |
Foreign References:
| JP2002256130A | 2002-09-11 | |||
| JPH06279687A | 1994-10-04 |
Attorney, Agent or Firm:
SENMYO Kenji et al. (JP)
Download PDF: