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Title:
RESIN COMPOSITION AND CONNECTOR
Document Type and Number:
WIPO Patent Application WO/2021/085240
Kind Code:
A1
Abstract:
[Problem] To provide: a resin composition which has excellent flowability and rarely undergoes the contamination with foreign matters, and from which a molded article having reduced warpage and/or deformation can be produced; and a connector molded from the resin composition. [Solution] A resin composition comprising (A) a wholly aromatic polyester, (B) a fibrous filler and (C) a sheet-like filler, wherein the component (A) contains constituent units (I) to (IV) as essential constituents, the contents of the constituent units (I), (II), (III) and (IV) respectively fall within specified mol% ranges relative to the total amount of all of the constituent units, the difference between the content of the constituent unit (III) and the content of the constituent unit (IV) is 0.150 mol% or less, the content of the wholly aromatic polyester (A) is 57.5 to 80% by mass, the content of the component (B) is 1.5 to 15% by mass relative to the whole mass of the resin composition, the content of the component (C) is 12.5 to 35% by mass relative to the whole mass of the resin composition, and the total amount of the components (B) and (C) is 20.0 to 42.5% by mass relative to the whole mass of the resin composition, and the weight average fiber length of the component (B) is shorter than 200 μm.

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Inventors:
FUKATSU HIROKI (JP)
NAGAE AKIHIRO (JP)
Application Number:
PCT/JP2020/039381
Publication Date:
May 06, 2021
Filing Date:
October 20, 2020
Export Citation:
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Assignee:
POLYPLASTICS CO (JP)
International Classes:
C08K7/00; C08L67/00; H01R13/46
Domestic Patent References:
WO2010013578A12010-02-04
WO2012137637A12012-10-11
WO2009141996A12009-11-26
WO2020204125A12020-10-08
Foreign References:
JP2006037061A2006-02-09
JP2010003661A2010-01-07
JP2011046191A2011-03-10
Attorney, Agent or Firm:
SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW (JP)
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