Title:
RESIN COMPOSITION, CURED FILM, LAMINATE, CURED FILM PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/066975
Kind Code:
A1
Abstract:
This resin composition contains at least one polymer precursor selected from polyimide precursors and polybenzoxazole precursors, wherein the total content of HNO2, NO2
-, HNO3, NO3
-, H2SO4, HSO4
-, SO4
2-, H2SO3, HSO3
-, and SO3
2- with respect to the total solid content of the resin composition is not less than 1 mass ppb but not more than 1000 mass ppm. The cured film, the laminate, the cured film production method, and the semiconductor device according to the present invention all use said resin composition.
Inventors:
OGAWA MICHIHIRO (JP)
IWAI YU (JP)
IWAI YU (JP)
Application Number:
PCT/JP2019/037187
Publication Date:
April 02, 2020
Filing Date:
September 24, 2019
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08G73/10; C08F299/02; C08L79/08; G03F7/037
Foreign References:
| JP2006188502A | 2006-07-20 | |||
| JPS55136246A | 1980-10-23 | |||
| JPH11116677A | 1999-04-27 | |||
| JP2001261824A | 2001-09-26 | |||
| JP2004111650A | 2004-04-08 | |||
| JP2005075949A | 2005-03-24 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
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