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Title:
RESIN COMPOSITION, CURED FILM, METHOD FOR PRODUCING MICROLENS, SOLID STATE IMAGING DEVICE, MICROLENS, AND TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2021/193221
Kind Code:
A1
Abstract:
The present invention provides a high refractive index resin composition that exhibits excellent heat resistance and dry etching properties by not containing a fused polycyclic aromatic compound and lowering the quantity of a metal compound that is difficult to etch. This resin composition contains: a polysiloxane (A) having a structure represented by formula (1); particles (B) of a composite oxide of titanium and one or more elements selected from the group consisting of aluminum, tin, zirconium and silicon; and a solvent (C). R1 denotes an alkyl group having 1-4 carbon atoms or an alkoxy group having 1-4 carbon atoms. n is 0 or 1, and * denotes a direct bond to a silicon atom.

Inventors:
ISHIKAWA YOSHIMI (JP)
HIBINO TOSHIYASU (JP)
NARUTO MASAYUKI (JP)
SUWA MITSUHITO (JP)
Application Number:
PCT/JP2021/010522
Publication Date:
September 30, 2021
Filing Date:
March 16, 2021
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08G77/04; C08K3/22; C08K5/28; C08L83/04; C08L101/00; H01L27/146
Domestic Patent References:
WO2016143895A12016-09-15
Foreign References:
JPH0725727A1995-01-27
JPH08253321A1996-10-01
JPH08505858A1996-06-25
JP2012087316A2012-05-10
JP2016183320A2016-10-20
JP2017014522A2017-01-19
JP2018012746A2018-01-25
JP2010229191A2010-10-14
JP2019143097A2019-08-29
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