Title:
RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE BOARD, RESIN SHEET, AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2021/172316
Kind Code:
A1
Abstract:
Provided are a resin composition that exhibits low water absorbency, a cured product, a prepreg, a metal foil-clad laminate board, a resin sheet, and a printed circuit board. The resin composition includes a compound (A) represented by formula (M1), and a compound (B) having two or more carbon-carbon unsaturated double bonds. In formula (M1), A is a 4-6 ring alicyclic group.
Inventors:
KOBAYASHI TAKASHI (JP)
HASHIGUCHI KAZUHIRO (JP)
HASEBE KEIICHI (JP)
HASHIGUCHI KAZUHIRO (JP)
HASEBE KEIICHI (JP)
Application Number:
PCT/JP2021/006751
Publication Date:
September 02, 2021
Filing Date:
February 24, 2021
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
B32B27/00; B32B15/08; C08F222/40; C08F299/02; C08J5/24; C08K3/013; C08L63/00; C08L71/12; C08L79/00; H05K1/03
Domestic Patent References:
| WO1993012933A1 | 1993-07-08 | |||
| WO2019230945A1 | 2019-12-05 | |||
| WO2020217675A1 | 2020-10-29 | |||
| WO2020217676A1 | 2020-10-29 | |||
| WO2016072404A1 | 2016-05-12 |
Foreign References:
| JP2009161725A | 2009-07-23 | |||
| JP2010138364A | 2010-06-24 | |||
| JP2017119739A | 2017-07-06 | |||
| JP2004277460A | 2004-10-07 |
Other References:
See also references of EP 4112298A4
Attorney, Agent or Firm:
SIKs & Co. (JP)
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