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Patent Searching and Data


Title:
RESIN COMPOSITION, CURED PRODUCT, PREPREG, METAL FOIL-CLAD LAMINATE BOARD, RESIN SHEET, AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2021/172317
Kind Code:
A1
Abstract:
Provided are a resin composition that exhibits high heat resistance and low permittivity, a cured product, a prepreg, a metal foil-clad laminate board, a resin sheet, and a printed circuit board. The resin composition includes a compound (A) represented by formula (M1), and a cyanate ester compound (B) having two or more aromatic moieties with at least one cyanate group substituent in each molecule. In formula (M1), A is a 4-6 ring alicyclic group.

Inventors:
KOBAYASHI TAKASHI (JP)
HASHIGUCHI KAZUHIRO (JP)
HASEBE KEIICHI (JP)
Application Number:
PCT/JP2021/006752
Publication Date:
September 02, 2021
Filing Date:
February 24, 2021
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
B32B15/08; B32B5/24; B32B15/09; B32B15/14; B32B27/36; C08G73/16; C08J5/24; C08K5/315; H05K1/03
Domestic Patent References:
WO1993012933A11993-07-08
WO2016072404A12016-05-12
WO2016125657A12016-08-11
WO2020217674A12020-10-29
WO2016072404A12016-05-12
WO2019230661A12019-12-05
Foreign References:
JP2009001783A2009-01-08
JP2010138364A2010-06-24
JP2004277460A2004-10-07
Attorney, Agent or Firm:
SIKs & Co. (JP)
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