Title:
RESIN COMPOSITION AND ELECTRONIC/ELECTRICAL DEVICE COMPONENT
Document Type and Number:
WIPO Patent Application WO/2021/090823
Kind Code:
A1
Abstract:
Provided are: a resin composition which has a low dielectric loss tangent and which is used in an electronic/electrical device component that uses electromagnetic waves having a frequency of 1 GHz or more; and an electronic/electrical device component that uses electromagnetic waves having a frequency of 1 GHz or more. This resin composition, which is used in an electronic/electrical device component that uses electromagnetic waves having a frequency of 1 GHz or more, contains a polycarbonate resin. The mass ratio of constituent units represented by formula (1) and polycarbonate units other than constituent units represented by formula (1) in the polycarbonate resin is 33-100:67-0. In formula (1), R1 and R2 are each independently a hydrogen atom or a methyl group, and W1 denotes a single bond or a divalent group.
Inventors:
KIKUCHI TATSUYA (JP)
NISHINO YOHEI (JP)
NISHINO YOHEI (JP)
Application Number:
PCT/JP2020/041157
Publication Date:
May 14, 2021
Filing Date:
November 04, 2020
Export Citation:
Assignee:
MITSUBISHI ENG PLASTICS CORP (JP)
International Classes:
C08G64/04; C08K3/013; C08K3/34; C08K3/38; C08K7/14; C08L69/00
Domestic Patent References:
| WO2019212020A1 | 2019-11-07 | |||
| WO2005075571A1 | 2005-08-18 | |||
| WO2019078162A1 | 2019-04-25 |
Foreign References:
| JP2010144182A | 2010-07-01 | |||
| JP2015108118A | 2015-06-11 | |||
| US3275601A | 1966-09-27 | |||
| JP2019156924A | 2019-09-19 | |||
| JP2019172712A | 2019-10-10 | |||
| JP2017110180A | 2017-06-22 | |||
| JP2019135290A | 2019-08-15 | |||
| JP2016216534A | 2016-12-22 |
Other References:
See also references of EP 4056623A4
Attorney, Agent or Firm:
SIKs & Co. (JP)
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