Title:
RESIN COMPOSITION, ELECTROCONDUCTIVE RESIN COMPOSITION, ADHESIVE, ELECTROCONDUCTIVE ADHESIVE, PASTE FOR FORMING ELECTRODES, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/158828
Kind Code:
A1
Abstract:
Provided is a resin composition having long-term heat resistance and rapid curing characteristics, with the adhesive strength being high when heated and the rate of change in the adhesive strength and the room temperature elastic modulus being low. The resin composition includes: (A) a compound having an OH group and any of a primary to tertiary amine in the molecule; (B) dicyandiamide and/or an imidazole; (C) a bismaleimide; and (D) a compound having at least one epoxy group in the molecule, or a cyanate ester.
Inventors:
YAMAGUCHI TAKASHI (JP)
ABE SHINICHI (JP)
ABE SHINICHI (JP)
Application Number:
PCT/JP2016/059842
Publication Date:
October 06, 2016
Filing Date:
March 28, 2016
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08L61/34; C08G14/073; C08G59/56; C08G73/00; C08G73/12; C08L63/00; C09J9/02; C09J11/06; C09J161/34; C09J163/00; C09J179/04; H01L21/288
Foreign References:
| JP2014523953A | 2014-09-18 | |||
| JP2010229227A | 2010-10-14 | |||
| JP2010248473A | 2010-11-04 | |||
| JP2013173819A | 2013-09-05 | |||
| JP2012213888A | 2012-11-08 | |||
| US20150189746A1 | 2015-07-02 |
Other References:
See also references of EP 3279261A4
Attorney, Agent or Firm:
ISSHIKI & CO. (JP)
All international patent business corporation (JP)
All international patent business corporation (JP)
Download PDF:
Previous Patent: LAYERED BODY
Next Patent: RESIN COMPOSITION, ELECTROCONDUCTIVE RESIN COMPOSITION, ADHESIVE, ELECTROCONDUCTIVE ADHESIVE, PASTE ...
Next Patent: RESIN COMPOSITION, ELECTROCONDUCTIVE RESIN COMPOSITION, ADHESIVE, ELECTROCONDUCTIVE ADHESIVE, PASTE ...