Title:
RESIN COMPOSITION FOR FLUX, ELECTRONIC COMPONENT, MANUFACTURING METHOD FOR ELECTRONIC COMPONENT, MOUNTING STRUCTURE, AND MANUFACTURING METHOD FOR MOUNTING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/187117
Kind Code:
A1
Abstract:
Provided is a resin composition for flux, the composition having good preservation stability and producing a cured product that has a high glass transition point. The resin composition for flux includes: an epoxy resin (A); an imidazole compound (B); a thixotropy agent (C); and an activator (D). The expoxy resin (A) contains at least one selected from the group consisting of: naphthalene epoxy resin; biphenyl aralkyl epoxy resin; trisphenol methane epoxy resin; biphenyl epoxy resin; and dicyclopentadiene epoxy resin, in an amount of 20 wt% or more with respect to the entire epoxy resin (A).
Inventors:
SANADA SHOHEI
YAMATSU SHIGERU
YAMATSU SHIGERU
Application Number:
PCT/JP2021/008245
Publication Date:
September 23, 2021
Filing Date:
March 03, 2021
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
B23K35/363; C08G59/40; C08L63/00
Domestic Patent References:
WO2013125684A1 | 2013-08-29 |
Foreign References:
JP2018053056A | 2018-04-05 | |||
JP2018053057A | 2018-04-05 | |||
JP2018161673A | 2018-10-18 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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