Title:
RESIN COMPOSITION FOR FORMING ELECTRODES, CHIP ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2018/181697
Kind Code:
A1
Abstract:
Provided is a low temperature sinterable resin composition for forming electrodes, which is excellent in terms of bondability and stability of electrical resistance after moisture resistance/heat resistance treatment. A resin composition for forming electrodes, which contains, as essential components, (A) a thermosetting resin, (B) a radical initiator, (C) silver fine particles having a thickness or breadth of 1-200 nm and (D) a silver powder other than the component (C), which has an average particle diameter of 2-20 μm, and wherein the thermosetting resin (A) contains (A1) a (meth)acrylate ester compound or (meth)acrylamide compound having a hydroxyl group, (A2) a bismaleimide resin which is in a liquid state at room temperature, and (A3) an epoxidized polybutadiene.
Inventors:
TAKAHASHI KAKERU (JP)
SAKURAI KAZUYOSHI (JP)
SAKURAI KAZUYOSHI (JP)
Application Number:
PCT/JP2018/013203
Publication Date:
October 04, 2018
Filing Date:
March 29, 2018
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01B1/22; C08F2/44; C08K3/08; C08K5/14; C08L33/14; C08L33/26; C08L35/00; C08L63/08; H01B1/00; H01C1/142; H01G4/30
Foreign References:
| JP2015162392A | 2015-09-07 | |||
| JP2011187194A | 2011-09-22 | |||
| JPH052915A | 1993-01-08 | |||
| JP2014145011A | 2014-08-14 |
Attorney, Agent or Firm:
SAKURA PATENT OFFICE, P.C. (JP)
Download PDF: